RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
Petach Tikva, Israel July 29, 2024 – RAAAM Memory Technologies, a start-up company that invented a groundbreaking solution to implement on-chip memory, announced today that it has been awarded with 5.25M€ from the European Innovation Council (EIC). The finances will be awarded via an initial grant component from the EIC Accelerator of 2.5M€ with a future equity investment component of 2.75M€ through the EIC Fund.
“We are proud to be one of the 68 companies chosen from 969 from 17 different countries. Beyond the financial contribution, this funding is an important validation of our technology” said Robert Giterman, RAAAM’s Co-Founder and CEO.
About RAAAM Memory Technologies
RAAAM‘s GCRAM is the most cost-effective on-chip memory technology in the semiconductor industry, providing up-to 50% silicon area reduction and up-to 10X reduced power consumption over SRAM, and it is fully compatible with the standard CMOS fabrication flow, requiring no additional process steps or cost.
RAAAM‘s patented technology enables the extension of Moore’s Law for on-chip memories and can be used by semiconductor companies as a drop-in replacement for SRAM in their chips.
Founded in 2021, the company is headquartered in Israel with R&D center in Switzerland.
|
Related News
- RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
- VSORA to Receive $13.18 Million in Funding from the European Innovation Council Accelerator Program
- Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding
- QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |