RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
Petach Tikva, Israel July 29, 2024 – RAAAM Memory Technologies, a start-up company that invented a groundbreaking solution to implement on-chip memory, announced today that it has been awarded with 5.25M€ from the European Innovation Council (EIC). The finances will be awarded via an initial grant component from the EIC Accelerator of 2.5M€ with a future equity investment component of 2.75M€ through the EIC Fund.
“We are proud to be one of the 68 companies chosen from 969 from 17 different countries. Beyond the financial contribution, this funding is an important validation of our technology” said Robert Giterman, RAAAM’s Co-Founder and CEO.
About RAAAM Memory Technologies
RAAAM‘s GCRAM is the most cost-effective on-chip memory technology in the semiconductor industry, providing up-to 50% silicon area reduction and up-to 10X reduced power consumption over SRAM, and it is fully compatible with the standard CMOS fabrication flow, requiring no additional process steps or cost.
RAAAM‘s patented technology enables the extension of Moore’s Law for on-chip memories and can be used by semiconductor companies as a drop-in replacement for SRAM in their chips.
Founded in 2021, the company is headquartered in Israel with R&D center in Switzerland.
|
Related News
- RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
- VSORA to Receive $13.18 Million in Funding from the European Innovation Council Accelerator Program
- Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding
- QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |