Xilinx Chips Selected For Latest 3G Wireless Test Platform From Agilent Technologies
Field Programmable Gate Arrays (FPGAs) Provide Re-configurability and Time-to-Market Advantages
SAN JOSE, Calif., June 9, 2003 - Xilinx, Inc. (NASDAQ:XLNX) today announced that Agilent Technologies, a global technology leader in communications, utilized Xilinx devices in the development of its latest wireless manufacturing test solution, the Agilent E5515C (8960) wireless communications test set.
The Agilent E5515C test set was developed specifically for the high-volume automated manufacturing test of wireless devices and offers the only one-box solution with the ability to adapt to current 2G and 3G formats. The advanced features of Xilinx Virtex and Spartan Series Platform field programmable gate arrays (FPGAs) were key enablers allowing Agilent to add new digital cellular formats to the E5515C test set as the new digital standards were developed, dramatically shortening Agilent's time-to-market. In addition, the flexibility of the FPGAs allows wireless device manufacturers to improve time-to-market and lower test costs by upgrading their Agilent E5515C test systems via the Internet as new standards emerge.
"Using Xilinx FPGAs provided Agilent with a time-to-market advantage and reduced our overall design costs in the process," said Al Schmidt, vice president of Agilent's Wireless Division. "The flexible nature of Xilinx programmable chips provided our design team with the luxury of repeated design iterations throughout the design process - which would not be possible using standard fixed ASIC technology.
"Agilent's unique application of our FPGAs underscores our ability to improve time-to-market and reduce costs for our customer's customer," said Wim Roelandts, president and CEO at Xilinx.
About Programmable Logic Devices
Xilinx leads one of the fastest growing segments of the semiconductor industry - programmable logic devices (PLDs) with 49% market share. PLDs represent an exciting growth potential in the chip market thanks to their flexible nature and ability to change functionality even after being manufactured and delivered in the field via Internet reconfigurability. Gartner/Dataquest forecasts the PLD market to grow to $5.6 billion by 2006.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC
- Mentor's Veloce Strato emulation platform selected by Iluvatar CoreX for verification of AI chips and software
- MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform
- Xilinx UltraScale 20nm Devices Enable JDSU ONT 400G Ethernet Test Platform
- Xilinx's DDR4 Memory Solution for UltraScale Devices Completes Agilent N6462A Compliance Test Running at 2400 Mb/s
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |