intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
Mont-Saint-Guibert, Belgium -- October 7, 2024 – intoPIX is thrilled to announce its participation in AutoSens Europe in Barcelona. This event presents a unique opportunity for automotive professionals to explore cutting-edge imaging solutions addressing the industry's most pressing challenges.
Pioneering Technologies for Automotive Applications
intoPIX will highlight its innovative JPEG XS and TicoRAW technologies, specifically designed for automotive applications.
These solutions provide high-quality image processing with ultra-low latency (<1ms) and minimal power consumption, critical for Advanced Driver Assistance Systems (ADAS) and autonomous vehicles. By enhancing image sensor performance and supporting high dynamic range, intoPIX's technologies ensure exceptional image quality for vision-based AI algorithms while minimizing complexity and adhering to ISO JPEG XS standards.
How intoPIX Makes a Difference
- Cloud Infrastructure: Advanced driver assistance relies on AI networks trained on vast image datasets collected globally and stored in the cloud. intoPIX’s software libraries, optimized for both CPUs and GPUs, allow for efficient compression of these datasets, significantly accelerating ADAS model development. Reducing storage requirements by 5 to 10 times, intoPIX enables cost-effective large-scale storage on public cloud platforms, facilitating continuous improvement of ADAS models and ensuring higher precision over time.
- Recorder: Vehicles equipped with data loggers capture images during transit, which are later uploaded to the cloud. intoPIX’s IP-core hardware for FPGAs or ASICs, combined with their software libraries, effectively compresses these images, maximizing storage capacity on data loggers and reducing storage costs. This approach also speeds up cloud upload times, enhancing overall efficiency and streamlining data management without the need for recompression.
- Camera Sensor: With JPEG XS RAW becoming the new standard for automotive image transmission, intoPIX's low-power ASIC solutions can integrate this technology directly into image sensors. This reduces data transfer rates to the central processor, lowers the power consumption of camera modules, and eliminates overheating issues. It also enhances image quality by removing bandwidth limitations, allowing for higher resolution, frame rates, and bit depth, thereby improving perception quality in ADAS platforms.
intoPIX remains committed to solving the industry's challenges with innovative solutions that improve efficiency, reduce costs, and enhance the overall performance of automotive imaging systems.
Visit intoPIX at AutoSens in Barcelona from October 08-10, 2024 (Booth #324) to discover how their technologies can revolutionize automotive imaging and tackle these critical challenges.
|
intoPIX Hot IP
Related News
- intoPIX Solutions Tackle the Biggest Challenges in Automotive Imaging at ADAS & Autonomous Vehicle Expo 2024
- QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
- Andes Technology Showcases Leadership in AI and Automotive Applications at RISC-V Summit Europe 2024
- intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023
- intoPIX Drives Innovation in Automotive Ethernet and Data Transmission
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |