eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP
Hsinchu, Taiwan, October 15, 2024 -- eMemory is proud to announce a groundbreaking SRAM repair solution that integrates Siemens’ Tessent™ MemoryBIST software with eMemory's NeoFuse OTP. The new solution is targeted at advanced AI SoCs that require high-density SRAM.
AI SoCs equipped with AI language models, data process units (DPU) and SRAM-based computing-in-memory (CIM) architectures are in increasing demand. The challenges of technology scaling, and the drastic increase in density, make manufacturing, yield and reliability of SRAMs crucial for smart SoCs. Autonomous built-in self repair (BISR) technology and one-time programmable (OTP) non-volatile memory are essential in overcoming the increasing challenges in embedded memory fault and yield issues.
As an industry-leading memory test solution, Tessent MemoryBIST from Siemens enables comprehensive automation and integration for at-speed test, diagnosis, repair, debug and characterization of on-chip memories. eMemory’s OTP plays an essential role in storing repair data. The integrated solution features OTP programming optimization for maximized efficiency. It benefits users with various SoC bus protocols. A distinguishing capability from eFuse is that NeoFuse supports memory built-in self test (MBIST) to do in-field re-test and repair without additional costs. This advantage is critical for high-end chip applications such as automotive applications.
"eMemory's OTP was strictly qualified by TSMC N5, N4P and N5A, which feature perfect yield, reliability, footprint and cost. The seamless combination of Tessent MemoryBIST from Siemens and eMemory's NeoFuse OTP presents maximized efficiency in supporting clients in maintaining their AI SoC's reliability," said Chris Lu, Senior Vice President of Business Development of eMemory.
“The paradigm shift across global IC markets towards AI technologies requires innovation solutions,” said Ankur Gupta, senior vice president and general manager, Digital Design Creation Platform, Siemens Digital Industries Software. “This solution can benefit advanced AI SoC customers with fast time to market, high yields and excellent reliability at low cost. Together, this solution can help optimize power, performance and area for customers.”
A list of relevant Siemens trademarks can be found here
About eMemory
eMemory (TPEX:3529) is a leading pure-play developer and provider of logic-based Non-Volatile Memory (Logic NVM) founded in 2000, and since 2019, eMemory started to offer PUF-based Security IP solutions based on its outstanding anti-fuse and physical unclonable function (PUF) technology.
Following the breakthrough success of one-time programmable memories (NeoBit / NeoFuse), eMemory expanded its portfolio of IPs, including multi-time programmable memories (NeoMTP / NeoEE), Flash memories (NeoFlash / RRAM / MRAM), and PUF technology (NeoPUF). Additionally, with the subsidiary, PUFsecurity Corp., eMemory enters the security sector by offering innovative PUF-based security subsystems and solutions, such as Root of Trust Module PUFrt and Crypto Coprocessor PUFcc.
As a world-leading IP provider, eMemory has delivered best-in-class designs to over 2,600 foundries, IDMs and fabless companies globally, and commits to push the technology envelope together with our partners in advanced applications.
For more information about eMemory, please visit www.ememory.com.tw
|
Related News
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology
- eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year
- eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
Breaking News
- Agile Analog announces MoU to support new Southern Taiwan IC Design Industry
- eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP
- September foundry sales: a tale of differing fortunes
- Exclusive Interview: Antti Rauhala Discusses CoreHW's CHW3021 Radio Front-End IC
- SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
Most Popular
- September foundry sales: a tale of differing fortunes
- Intel, TSMC to detail 2nm processes at IEDM
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
- DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs
E-mail This Article | Printer-Friendly Page |