English
Intel-Samsung foundry collaboration
Intel’s reported move to discuss cooperation with Samsung in their respective foundry businesses suggests that Intel is not confident it can gain process technology leadership next year.
By David Manners, ElectronicsWeekly (October 24, 2024)
If Intel’s 18A process looked like achieving industry supremacy while running at commercial yields by the end of next year, then the company would be on track to making a success of its foundry business on its own.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
- Intel and UMC Announce New Foundry Collaboration
- Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements
- Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity