Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
By Alan Patterson, EETimes (December 3, 2024)
The sudden departure of Pat Gelsinger as the CEO of Intel leaves the struggling U.S. chipmaker adrift, according to analysts who spoke to EE Times.
The company’s plan to ramp production of its 18A chips and regain process technology leadership is unclear. Intel has lost market share in its core CPU business to AMD while failing to gain traction in smartphone and AI chips. Intel’s effort to divest its chipmaking unit, Intel Foundry, as a successful standalone business is likely to take years, and doing so could forfeit its CHIPS Act subsidies. Intel Foundry needs to catch up in quality and cost where larger rival Taiwan Semiconductor Manufacturing Co. (TSMC) is the leader.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
- IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
- ARC CEO: 'Impatient capital' hinders U.S. IC industry
- Intel's New CEO Called "Strong Choice" to Respin Company
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation