IP players prominent in chiplet's 2024 diary
By Majeed Ahmad, EDN (December 2, 2024)
Chiplets—discrete semiconductor components co-designed and manufactured separately before being integrated into a larger system—are emerging as a groundbreaking approach to addressing many of the challenges faced by monolithic system-on-chip (SoC) designs. They have also become a major venue for increasing transistor density as Moore’s Law slows down.
While large semiconductor outfits like AMD and Intel were initially prominent in the chiplets world, IP players are now increasingly visible in showcasing the potential of chiplets. That includes established IP players like Arm and Cadence as well as upstarts such as Alphawave Semi.
E-mail This Article | Printer-Friendly Page |
Related News
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
- Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models