Rambus and Micron Technology Extend Patent License Agreement
Five-year agreement extends product collaboration and enables broad access to Rambus innovations
SAN JOSE, Calif.-- December 10, 2024 -- Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced it has extended the term of its comprehensive patent license agreement with Micron Technology, Inc. for an additional five years. The extension maintains the existing licensing terms, providing Micron with broad access to the Rambus patent portfolio through late 2029. Other terms and details are confidential.
“We are very pleased to continue our strategic relationship with Micron,” said Luc Seraphin, president and chief executive officer of Rambus. “This extension enables our continued collaboration, and we look forward to working together to bring further advancements to the industry.”
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
|
Related News
Breaking News
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Creonic Introduces Doppler Channel IP Core
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
- YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
Most Popular
- Imagination pulls out of RISC-V CPUs
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- RISC-V in AI and HPC Part 1: Per Aspera Ad Astra?
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
E-mail This Article | Printer-Friendly Page |