SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
WASHINGTON—Jan. 13, 2025—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer regarding the Biden Administration’s decision to publish an interim final rule titled, “Export Control Framework for Artificial Intelligence Diffusion.” This regulatory action imposes global restrictions and onerous licensing requirements on U.S. exports of advanced integrated circuits. Several regulations have already been implemented in recent years to control and restrict access to advanced semiconductors.
“We’re deeply disappointed that a policy shift of this magnitude and impact is being rushed out the door days before a presidential transition and without any meaningful input from industry. The new rule risks causing unintended and lasting damage to America’s economy and global competitiveness in semiconductors and AI by ceding strategic markets to our competitors. The stakes are high, and the timing is fraught. We stand ready to work with leaders in Washington to chart a path forward that protects national security while allowing us to do what America does best – compete and win globally.”
About SIA
The Semiconductor Industry Association (SIA) is the voice of the semiconductor industry, one of America’s top export industries and a key driver of America’s economic strength, national security, and global competitiveness. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms. Through this coalition, SIA seeks to strengthen leadership of semiconductor manufacturing, design, and research by working with Congress, the Administration, and key industry stakeholders around the world to encourage policies that fuel innovation, propel business, and drive international competition. Learn more at www.semiconductors.org.
|
Related News
- SIA Statement on Trump Administration Section 301 Action on China
- Intel CEO Voices Concerns About CHIPS Funds, Export Controls
- Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space
- DeepX Hints At Next-Gen AI Chips
- HCLTech and Arm Collaborate on Custom Silicon Chips Optimized for AI Workloads
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |