English
OpenAI to tape-out on TSMC 3nm this year
By David Manners, ElectronicsWeekly (February 11, 2025)
OpenAI will tape-out its first chip on TSMC 3nm later this year, reports Reuters, with the intention of putting it into volume production in 2026.
The chip will be used for both training and inference. It has been designed by an in-house team of 40 people led by Richard Ho. The team is working in collaboration with Broadcom.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Kalray announces the Tape-Out of Coolidge on TSMC 16NM process technology
- Silicon Creations Celebrates 100th Tape-Out of Its PLL in TSMC 28nm Process Technology
- KnCMiner raises $15M led by Accel Partners and completes 16nm tape-out with TSMC
- ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology
- TSMC Launches Integrated Sign-Off Flow To Shorten Design Cycle, Enhance Tape-Out Quality
Breaking News
- Semiconductor Giants Navigate AI Boom & Trade War
- OpenAI to tape-out on TSMC 3nm this year
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- intoPIX Drives Innovation in Automotive Ethernet and Data Transmission
- Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex