Palmchip Receives Key System-on-Chip Patent
SAN JOSE, California, August 04, 2003 – Palmchip Corporation, a pioneer in semiconductor IP and system-on-chip technology, today announced that the US Patent and Trademark Office (www.uspto.gov) has awarded the company a key patent for the company’s technology facilitating the easy connection of IP blocks within a system on chip design. The patent (US Pat. No. 6,601,126), titled Chip-core Framework for Systems-On- a-Chip, will protect the company’s technology for building system on chips using a unidirectional bus structure enabling point-to-point connectivity for internal SoC IP cores. This technology was initially introduced to the chip design community through the company’s CoreFrame® SoC architecture.
The CoreFrame SoC architecture is used in Palmchip’s two SoC platform products, PalmPak™ and the flagship AcurX™ platform. Both platforms are configurable and are tested, pre-verified and silicon proven.
"This favorable decision from the U.S. Patent and Trademark Office represents a significant milestone in our company's history," said Jauher Zaidi, President and CEO of Palmchip Corporation. "The granting of this patent validates our SoC technology leadership and reflects our history of innovation in system on chip platform design in addition to protecting our intellectual property."
"We believe that this patent grant could have a wide-ranging impact on those companies who have created SoC devices or marketed SoC platforms using unidirectional busses as a method of assembling separate IP blocks within a design," said Jim Venable, vice president of Palmchip. "It is our intention to aggressively protect our intellectual property by making the technology available under license to those companies wishing to use it."
About Palmchip Palmchip
Corporation develops and licenses configurable SoC platforms, subsystems, and IP cores for embedded SoC's used in a variety of applications. Palmchip's IP is based on its CoreFrame® integration technology. This technology is independent of processor, I/O or foundry, allowing designers flexibility in porting IP from any number of sources. Palmchip was established in 1996 and is today a privately held company based in San Jose, California (USA). More information can be obtained at www.palmchip.com.
Palmchip, the palm leaf logo and CoreFrame are registered trademarks of Palmchip Corporation. AcurX, PalmPak, Matrix, Timing Taps, and CrosSwitch are trademark of Palmchip Corporation. All other trademarks are the property of their respective owners
|
Related News
- DAFCA Receives $1.8 Million ATP Grant to Develop Reconfigurable Infrastructure Platform for System-on-Chip Electronics
- Palmchip Introduces New AcurX Series of Configurable System-On-Chip Platforms for Mega-gate Chip Designs
- Palmchip Introduces New GreenLite™ II Family of Complete System-On-Chip IP Solutions for Disk Drive Control <!--<FONT SIZE=-1>(by Peter Clarke - EE-TIMES)</FONT>-->
- Palmchip to Include inSilicon Intellectual Property in System-on-Chip Platforms
- Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |