Japan: Chipmakers aim to regain lead
Starting this month, five major domestic semiconductor makers will begin supplying the basic technology for next-generation semiconductor chips to foreign competitors in a bid to help Japan regain the top position in the industry by establishing the new technology as the standard in the global market.
The five makers, including Toshiba Corp. and NEC Electronics Corp., developed the new technology for manufacturing semiconductor chips jointly with the government.
The technology was developed by Advanced SoC Platform Corp. (ASPLA), which was jointly established by 10 domestic firms in July last year, under the leadership of the Economy, Trade and Industry Ministry.
Read more ....
Related News
- Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business
- Intel Looks to Regain Innovation Lead
- Sondrel announces CEO transition to lead next phase of growth
- Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion
- Axiomise Showcases Value of Formal Verification at DVCon Japan and DVCon India
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |