Taiwan's Via Technologies rolls out fastest embedded processor
![]() |
Taiwan's Via rolls out fastest embedded processor
By Mark LaPedus, Silicon Strategies
August 19, 2003 (11:11 a.m. EST)
URL: http://www.eetimes.com/story/OEG20030819S0014
TAIPEI, Taiwan Taiwan's Via Technologies Inc. on Tuesday(Aug. 19) rolled out its fastest x86-based microprocessor for embedded and "multifunctional fanless devices." Via's Eden ESP7000 processor is a 733 MHz device based on the company's CoolStream architecture. It features the so-called PadLock Data Encryption Engine for secure applications in the entertainment, communications, commercial and industrial fields. The processor is geared for set-top boxes, thin clients, point-of-sale terminals and industrial PCs. "The new Via Eden ESP7000 processor has raised the performance bar for this segment and enables quick time to market for a range of system designs for a variety of advanced applications," said Richard Brown, Via's associate vice president of marketing. Housed in Via's low-profile EBGA package, the ESP7000 consumes 6 watts of maximum thermal design power and nearly 1 watt of typical power when running at a clock speed of 733 MH z. The processor features the company's StepAhead Advanced Branch Prediction technology, 16 pipeline stages, SSE multimedia instructions, a floating point unit and 64 Kb of L2 cache. Via said the ESP7000 processor is shipping now in volume.
Related News
- Toshiba, MIPS to develop fastest 64-bit embedded processor based on 'Amethyst' core
- VeriSilicon's Neural Network Processor IP Embedded in Over 100 AI Chips
- BrainChip Demonstrates Company's Event-Based AI Neural Processor at Embedded Vision Summit
- Synopsys' New Embedded Vision Processor IP Delivers Industry-Leading 35 TOPS Performance for Artificial Intelligence SoCs
- Pixilica Licenses SiFive's RISC-V Embedded Processor IP
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |