Infineon licenses ParthusCeva's Teaklite DSP core
SAN JOSE, CA, September 3, 2003 - ParthusCeva, Inc. (Nasdaq: PCVA, LSE: PCV) the leading licensor of Digital Signal Processor (DSP) cores and solutions to the semiconductor industry, announced today that ParthusCeva’s TeakLite® DSP core is powering Infineon Technologies’ latest single-chip GSM/GPRS wireless baseband controller, the S-GOLDlite™.
Infineon’s licensing of the TeakLite DSP core for its next generation GSM/GPRS baseband builds on many years of successful use of ParthusCeva’s earlier DSP core, OAKDSPCore®, which Infineon had deployed to power previous 2G and 2.5G wireless and wireline communications products. For the S-GOLDlite™ wireless baseband controller, Infineon has combined ParthusCeva’s TeakLite DSP core with the ARM926™ microprocessor in a highly optimized single-chip solution delivering full GPRS class-12 support and high-performance multimedia capabilities.
“We are delighted to extend our long-standing relationship with Infineon Technologies through the deployment of our TeakLite DSP core in their 2.5G S-GOLDlite baseband,” said Chet Silvestri, CEO of ParthusCeva. “Infineon 2G baseband solutions, powered by ParthusCeva DSP cores have achieved tremendous market success, and we look forward to replicating that success with their new generation 2.5G GPRS and EDGE chipsets.”
About TeakLite
TeakLite is a 16-bit fixed-point general-purpose DSP core. Designed as a solution for low-power, high-performance applications and high-speed digital processing applications such as speech and audio processing, wireless communication (GSM, CDMA, TDMA, EDGE, GPRS, etc.), modems, advanced telecommunication systems, disk-drive controllers and embedded control applications, TeakLite, is a fully synthesizable soft core and a process independent core that is easily portable to any ASIC library.
TeakLite is a member of ParthusCeva's SmartCores™ family. These low-power, fixed-point licensable DSP cores offer a range of performance, price and power consumption balances, addressing a wide range of applications, from low-end, high-volume applications, such as digital answering machines, hard disk controllers, low speed modems and Voice over IP terminals, to high performance applications such as third generation (3G) cellular communications, broadband modems, consumer multimedia and Voice over IP gateways. A comprehensive portfolio of software and hardware development tools supports the SmartCores family. In addition, a large network of third party companies offers applications, tools and design services solutions.
OakDSPCore, PalmDSPCore, Teak, TeakLite, CedarDSPCore and SmartCores are trademarks and registered trademarks of ParthusCeva, Inc. All other trademarks are the property of their respective owner.
About ParthusCeva
Headquartered in San Jose, ParthusCeva (Nasdaq: PCVA) and (LSE: PCV) is the leading licensor of DSP with a share of two thirds of the market in 2002 (Source: Gartner-Dataquest) and a leading provider of application-specific platform Intellectual Property (IP) to the semiconductor industry. ParthusCeva was created as a result of the combination of Parthus Technologies plc, a leading provider of application-specific platform IP, and Ceva, formerly the licensing division of DSP Group, the leading licensor of DSP cores.
For more information, visit us at http://www.parthusceva.com.
ParthusCeva Safe Harbor Statement
This document contains "forward-looking statements", which are subject to certain risks and uncertainties that could cause actual results to differ materially from those stated. Any statements that are not statements of historical fact (including, without limitation, statements to the effect that the company or its management "believes," "expects," "anticipates," "plans" and similar expressions) should be considered forward-looking statements. Important factors that could cause actual results to differ from those indicated by such forward-looking statements include uncertainties relating to the ability of management to successfully integrate the operations of Parthus and Ceva, uncertainties relating to the acceptance of our DSP cores and semiconductor intellectual property offerings, continuing or worsening weakness in our markets and those of our customers, quarterly variations in our results, and other uncertainties that are discussed in the registration statement on Form S-1and the most recent quarterly report on Form 10-Q of ParthusCeva (formerly called Ceva, Inc.), on file with the U.S. Securities and Exchange Commission.
|
Ceva, Inc. Hot IP
Related News
- Renesas Technology Licenses ParthusCeva's TeakLite DSP Core for Cellular Handsets
- VIA Telecom Licenses ParthusCeva TeakLite DSP Core to Power Next Generation 2.5G and 3G Wireless Modems
- DSP Group Licenses Parthusceva's Bluetooth Technology Targeting Residential Wireless Systems
- Spreadtrum Communications Licenses ParthusCeva High Performance TeakLite DSP Core Technology
- Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |