English
Silicon & Software Systems (S3) announce availability of Mixed Signal IP for IEEE 802.11 IC Designs
Dublin, Ireland, 12th September 2003 - , a leading supplier of mixed signal circuit solutions, today announced the availability of a range of IP for the analog front-end section of IEEE802.11a/b/g ICs. This IP is silicon-proven on TSMC's 0.18um CMOS process and has been characterized for applications in the multi-band WLAN market.
In a highly competitive market such as the WLAN chip sector, IC designers are facing schedules of less than 12 weeks from specification to tape-out including full chip integration. Many are turning to specialist design houses, such as S3, for fully characterized silicon upon which to base their designs. S3's IP can be delivered in matched "I&Q" pair configurations - ensuring minimum chip finishing requirements.
"Our customers are keen to use S3's IP to accelerate their chip integration and design cycle times," said Bob Tait, Product Marketing Manager at S3. "Using S3's IP removes significant risk from 802.11 WLAN product developments. This allows valuable engineering effort to be focused on clear differentiation in the system product design."
S3's portfolio of mixed signal IP includes 10 bit pipeline ADCs up to 80 MSPS and DACs up to 200MSPS with supporting PLL and reference circuits.
S3 will present their complete mixed signal portfolio at the TSMC Europe Technology Symposium, Brussels, on September 23rd next.
About Silicon & Software Systems Ltd. (S3)
Silicon & Software Systems Ltd. (S3) is an established electronics design company. S3 specializes in System Level Design and Integration in four market areas: Wireless Systems, Digital Consumer, Network Processing and Medical Systems.
S3 delivers leading edge design solutions in the areas of Wireless Connectivity (Bluetooth, 802.11, Zigbee, etc.) and Digital Telephony (GSM, 3G, DECT, PHS, etc.). These solutions are enabled by S3's wide variety of expertise in areas such as embedded Wireless SoC design, system integration, embedded software and lower layer software development. S3 provides solutions for both OEMs and IC vendors including hardware reference designs.
The company specializes in the integration of wireless technologies into end products for both the consumer and enterprise markets.
Approximately 50% of clients are U.S. based with the remainder based in Europe and the Asia/Pacific region. S3 was founded in Dublin, Ireland in 1986 and has operations in five countries: Ireland, U.S.A., the Netherlands, Poland and the Czech Republic.
S3 web site: www.s3group.com
S3's Mixed Signal Solutions Center: www.s3group.com/design/ic/mixed
|
||||||
Related News
- Silicon Interfaces Introduces 802.11 a,b and g IEEE Standard WLAN Base Band Processor Intellectual Property
- Silicon Interfaces Announces 802.11 a/b and g IEEE Standard Intellectual Property
- SeaSolve Software Inc. Announces IEEE 802.15.4 WPAN And IEEE 802.11 WLAN Compliance Test And Analysis Solution
- ChipIdea, a leading analog and mixed-signal IP and SoC solutions provider, announces a new generation of analog front-ends (AFEs) for 802.11 Wireless LAN applications
- GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |