ParthusCeva Announces Architecture Standard for Hybrid DSP/RISC-Based System-on-Chip for ARM Environment
Industry collaboration standardizes the full range of hardware and software interfaces between a CPU and DSP for system-on-chip solutions
San Jose, Calif - September 29, 2003 - ParthusCeva, Inc., [(Nasdaq: PCVA); (LSE: PCV)], the industry's leading licensor of Digital Signal Processor (DSP) cores and solutions today announced a specification for an architecture covering the integration of ARM cores together with ParthusCeva DSP SmartCores™.
The majority of System-on-Chips (SoC) combine a RISC microprocessor and DSP processor core in the same chip creating a complex design, development and verification process. To reduce the risk, cost and complexity of these systems, ParthusCeva and ARM, the world's leading developers of DSP processors and RISC microprocessors respectively, have collaborated in four key technical areas.
- The joint specification standard for hybrid RISC/DSP based system-on-chip which covers the hardware interfaces between the cores for sophisticated mailbox-based command and control messaging and bulk data passing, debug and trace interfaces and protocols for multi-core debug and software APIs for inter-processor communications. The specification also includes circuitry for low latency message passing and bulk data transfer integrated with powerful DMA capabilities.
- In support of the architecture, ParthusCeva's announces that its XpertDSP platform supports AMBA™ methodology.
- The development of the RealView® Developer Suite advanced multi-core debug tools enabling support for ParthusCeva Teak DSP core and XpertTeak System.
- Combined development board environments. ParthusCeva TeakLite and Teak cores and the XpertDSP sub-system available as core modules which seamlessly combine with the ARM RealView Integrator™ platform.
"Hybrid solutions combining CPU and DSP cores are key to many new digital devices and particularly key to the burgeoning application-processing market," said Gideon Wertheizer, Executive VP of ParthusCeva. "Our mutual customers will greatly benefit from a standard integration between the two leading RISC and DSP architectures, and this further enhances our position as the leading DSP architecture of choice for the mobile world."
"As a significant number of ARM core-based systems combine an ARM core and ParthusCeva's DSP cores, ARM's DSP Interface Specification will be of great value to our mutual customers and should further enhance the capabilities of the ARM architecture," said Matthew Byatt, Marketing manager, ARM.
The new specification eases dual core development by combining ASIC hardware platforms, various development boards, the RealView Debugger and hardware development tools. In addition, the new standard's installed software base further enables developers to shorten time to market for their multi-core chipsets.
The RISC/DSP architecture standard will span the various generations of ARM processors, including the ARM7™ and ARM9™ core families, alongside all members of ParthusCeva's industry leading SmartCores DSP family.
About ParthusCeva, Inc.
Further information about ParthusCeva
###
OakDSPcore, TeakLIte, and Teak are registered trademarks and XpertTeak and SmartCores are trademarks of ParthusCeva, Inc. Other brands and products referenced herein are the trademarks or registered trademarks of their respective holders. ARM and RealView are registered trademarks of ARM Limited. ARM7, ARM9, and AMBA are trademarks of ARM Limited. All other brands or product names are the property of their respective holders. "ARM" is used to represent ARM Holdings plc (LSE: ARM and Nasdaq: ARMHY); its operating company ARM Limited; and the regional subsidiaries ARM INC.; ARM KK; ARM Korea Ltd.; ARM Taiwan; ARM France SAS; ARM Consulting (Shanghai) Co. Ltd.; and ARM Belgium N.V.
ParthusCeva Safe Harbor Statement
Various statements in this press release concerning ParthusCeva's future expectations, plans and prospects are "forward-looking statements", which are subject to certain risks and uncertainties that could cause actual results to differ materially from those stated. Any statements that are not statements of historical fact (including, without limitation, statements to the effect that the company or its management "believes", "expects", "anticipates", "plans" and similar expressions) should be considered forward-looking statements. These statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from those described, including the following:
- the industries in which we license our technology are experiencing a challenging period of slow growth that has negatively impacted and could continue to negatively impact our business and operating results;
- the markets in which we operate are highly competitive, and as a result we could experience a loss of sales, lower prices and lower revenue;
- our operating results fluctuate from quarter to quarter due to a variety of factors including our lengthy sales cycle, and are not a meaningful indicator for future performance
- we rely significantly on revenue derived from a limited number of licensees; and
- other risks discussed in "Management's Discussion and Analysis of Financial Condition and Results of Operations--Factors that Could Affect Our Operating Results," in our quarterly report on Form 10-Q for the first quarter of 2003, filed with the U.S. Securities and Exchange Commission on May 14, 2003.
|
Ceva, Inc. Hot IP
Related News
- ParthusCeva and ARM Collaborate to Create Common Development Environment for Hybrid CPU/DSP-Based System-on-Chip
- Philips And ARM Announce First High Performance 32-bit RISC-based standard Embedded Controller using 0.18
- Arteris IP and Magillem Partner to Create Integrated System-on-Chip Architecture Environment
- ARM Ecosystem Collaborates to Deliver Initial Server Platform Standard
- XpandR - a Wireless Multimedia System-on-Chip Platform to Be Launched by DSP Group
Breaking News
- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- Dolphin Semiconductor strengthens its governance with two key Board appointments
Most Popular
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
E-mail This Article | Printer-Friendly Page |