Bluetooth low energy v6.0 Baseband Controller, Protocol Software Stack and Profiles IP
Motorola Licenses StarCore DSP Technology to Power Future Generations of Embedded Products
StarCore LLC’s DSP cores and subsystems optimized to meet performance demands of Motorola’s industry-leading applications
AUSTIN, Texas – October 13, 2003 – To help improve the performa nce, efficiency and cost of future embedded applications, Motorola Inc’s (NYSE:MOT) Semiconductor Products Sector (SPS) is licensing StarCore LLC’s portfolio of DSP cores and subsystems. Motorola plans to use StarCore’s DSP technology as an integral part of future embedded system offerings targeted toward a variety of next-generation products that require efficient, high-performance processing capabilities.
StarCore’s licensable DSP cores and subsystems are scalable, synthesizable and optimized to help original equipment manufacturers and system-on-a-chip designers meet the ever-increasing performance demands of communications and consumer products. Scalability gives system designers the option of using the same DSP core in multiple applications which reduces the amount of code that needs to be developed, accelerates time-to-market and minimizes overall complexity. Synthesizability lends itself to manufacturing flexibility and provides system designers with a variety of product development options.
“StarCore’s DSP architecture provides us with tremendous flexibility,” said Ray Burgess, corporate vice president and director of Strategy, Marketing and Communications for Motorola SPS. “We plan to utilize the platform to implement a variety of compelling products and derivatives that span several of our target markets. StarCore’s DSP technology will be a significant strategic asset to our portfolio as we move forward defining future generations of embedded systems.”
The fluctuating global economic environment and cyclical nature of the technology industry make licensing a very attractive option for equipment providers and semiconductor manufacturers. Licensing a proven DSP architecture eliminates much of the up-front research and development costs and helps get products into the market much more quickly than developing the technology from scratch.
“Motorola’s decision to license StarCore technology for future generations of embedded systems is a strong endorsement for the performance and value proposition of our products,” said Tom Lantzsch, CEO of StarCore LLC. “It also serves to validate our business model. Buying well-supported DSP intellectual property rather than making it yourself is a smart business decision. It reduces development costs without compromising performance.”
Financial details of the licensing agreement were not disclosed.
About StarCore LLC
Based in Austin, Texas, StarCore LLC is a leader in the development of highperformance DSP architectures, cores and intellectual property building blocks for the communications and consumer electronics industries. For more information on StarCore LLC and its intellectual property and services, visit the company’s Web site at www.starcore-dsp.com.
# # #
Copyright © 2003, StarCore, LLC. All rights reserved. All trade and service marks are the property of their respective owners. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office.
|
Related News
- StarCore Licenses Its DSP Platforms to Infineon to Power Next- Generation Mobile Communications Products
- Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
- Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology
- Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence
- Spansion Licenses ARM Processor Technology to Power Embedded Systems for Automotive, Industrial and Consumer Applications
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |