Open Core Protocol group (OCP-IP) snags Cadence
![]() |
Open Core Protocol group snags Cadence
By Richard Goering, EE Times
October 30, 2003 (7:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20031030S0062
SANTA CRUZ, Calif. Claiming a significant win for the system-on-chip (SoC) standards organization, the Open Core Protocol International Partnership (OCP-IP) has welcomed Cadence Design Systems into its ranks. Cadence will become a sponsor member and a participant in OCP-IP's working groups. OCP-IP is working to support and promote the Open Core Protocol, a key element in the interconnect scheme developed by Sonics Inc. The organization promotes OCP as a complete socket standard that allows rapid creation and integration of intellectual property (IP) blocks. Victor Berman, group director for Cadence's language and standardization strategy, said that the OCP-IP approach helps speed design through the use of standard interfaces that support interoperable IP sockets. As a working group member, he said, Cadence will help develop enhancements and infrastructure support for OCP. OCP-IP's governi ng steering committee participants include Nokia, Texas Instruments, ST Microelectronics, UMC and Sonics. The general membership roster includes semiconductor, silicon IP, and EDA providers. In addition to Cadence, EDA vendors including Axys, Beach Solutions, CoWare, Esterel Technologies, Mentor Graphics, Synopsys, Summit, TNI-Valiosys, and Verisity are OCP-IP members. Earlier this month, OCP-IP and the Virtual Socket Interface Alliance (VSIA) announced that OCP-IP will chair the VSIA on-chip bus design working group, and will gain a seat on the VSIA technical committee.
Related News
- OCP-IP Announces Support for Cadence's Assertion Based OCP Protocol Verification IP
- Jasper Design Automation Joins Open Core Protocol International Partnership (OCP-IP)
- STMicroelectronics, Inc. joins Open Core Protocol International partnership (OCP-IP)
- Accellera Systems Initiative Acquires Open Core Protocol Standard and Infrastructure to Strengthen Interoperability in Electronic Standards Development
- Renesas Mobile Corporation Enters Into Open Core Protocol International Partnership
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |