Report: Microsoft to become chip company with Xbox

![]() |
Report: Microsoft to become chip company with Xbox LONDON Rather than take standard chips from suppliers for its next Xbox, Microsoft Corp. is planning to license intellectual property from suppliers and actively participate in the design of chips that would be forwarded to foundries, according to a report by CNET. The report said the approach would allow Microsoft to better optimize its game console, address hacking problems and potentially sell chips or derivatives for other applications. Microsoft would become a fabless chip company with itself as the primary customer, the report said. Xbox Next is not due to appear until 2005. Previously, expectations had been raised that the next-generation Xbox would appear in time for the 2004 holiday season. Microsoft is licensing graphics technology from ATI Technologies, processor technology from IBM Corp. and chip set technology from Silicon Integrated Systems (SIS). Microsoft will then work with its partners to create a set of custom chips, the report quoted unnamed sources as saying. IBM's design win for the next Xbox, displacing Intel in the current game platform, was disclosed last week, although there was no discussion in the announcement about whether there was a chip component design win or a technology licensing deal. The Xbox arrangement would mirror Sony's relationship with IBM and Toshiba to create the so called Cell processor for its Playstation game hardware, the report said. Sony is also seeking wider sales opportunities for the Cell processor. Microsoft is expected to follow up its intellectual property licensing deals with foundry contracts. "Manufacturing is not part of the agreement yet. It is up to them what they do with manufacturing," the report quotes an IBM representative as saying. Copyright 2005 © CMP Media LLC
Courtesy of Silicon Strategies
Nov 10 2003 (13:00 PM)
URL: http://www.embedded.com/showArticle.jhtml?articleID=16100095

Related News
- Microsoft Employs Cadence Tensilica Processors in Xbox One
- Microsoft to Become One of World's Leading Chip Buyers on Nokia Acquisition
- Report: Microsoft to pay Nokia $1 billion for support
- Microsoft Xbox Development Team Uses SpringSoft's Verdi Debug Software to Slash Design Time
- Microsoft Embraces TSMC 90nm Embedded DRAM Process for Xbox 360
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |