5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
Faraday adopts Cadence Encounter Platform for Structured ASIC design
TAIPEI, China – December 8, 2003 – Cadence Design Systems, Inc. (NYSE:CDN) and Faraday Technology Corporation (TAIEX: 3035) today announced that Faraday has successfully developed a design implementation flow for its Metal Programmable Cell Array (MPCA) structured ASIC technology, using the Cadence Encounter digital IC design platform. This is a significant milestone, as structured ASIC design represents the next step towards meeting different types of product volume requirements. Cadence is the first EDA vendor to enable Faraday to conduct actual chip implementation methodology with its structured ASIC paradigm.
Structured ASIC Flow with the SoC Encounter System
Faraday structured ASIC implementation flow was based on Cadence's leading-edge continuous convergence methodology provided by the Cadence Encounter platform. The flow was successfully validated with an actual test chip tape-out in May 2003. The major benefit of the flow is that it helps Faraday engineers drive its customer design netlist from a structured ASIC floorplan specification to a physical design, with fast and guaranteed timing and signal integrity (SI) closure. The necessary capabilities include silicon virtual prototyping, floorplanning, placement and routing, clock tree synthesis, physical timing optimization, RC extraction, SI crosstalk closure, and physical ECO.
"Our customers can enjoy accelerated development cycles and lower derivation costs by using the winning combination of Faraday's MPCA technology, mass production proven intellectual property (IP) portfolios, and state-of-the-art ASIC services," said Hsin Wang, senior technical director of Faraday "SoC Encounter greatly helps us fine-tune designs at an early stage and drives fast design closure on timing, power, and signal integrity," he added.
"We are absolutely delighted to have been selected by Faraday to join them in the utilization of this pioneering structured ASIC technology," said Wei-Jin Dai, vice president of research and development at Cadence. "This successful cooperation highlights our commitment to customer success and further validates the significance of our First Encounter system."
About Faraday Technology Corporation
Faraday Technology Corporation provides leading ASIC/SoC design services and production-proven IPs to customers ranging from system houses and IDMs to IC design houses. The company's broad portfolio of key IPs includes leading products such as RISC CPUs, 16/20/24-bit DSPs, USB 2.0, gigabit Ethernet, and Serial-ATA. Faraday's ASIC design services and IPs are widely used in PC peripherals, communication, and digital consumer products. With more than 480 employees and 2002 revenue of 96.2 million USD, Faraday is the largest fabless ASIC design service company in all Asia-Pacific. Headquartered in Hsinchu Taiwan, Faraday offers service and support branch offices around the world, including the U.S., Japan, Europe, and China. For more information on Faraday, please visit http://www.faraday.com.tw
About Cadence
Cadence is the largest supplier of electronic design technologies, methodology services, and design services. Cadence solutions are used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics, and a variety of other electronics based products. With approximately 5,000 employees and 2002 revenues of approximately $1.3 billion, Cadence has sales offices, design centers, and research facilities around the world. The company is headquartered in San Jose, Calif., and traded on the New York Stock Exchange under the symbol CDN. More information about the company, its products and services is available at www.cadence.com.
--end--
Cadence, the Cadence logo, SoC Encounter and First Encounter are registered trademarks of Cadence Design Systems, Inc. and Encounter is a trademark of Cadence. All other trademarks are the property of their respective owners.
|
Faraday Technology Corp. Hot IP
Related News
- NEC Electronics and Cadence Announce Encounter Platform to Support NEC Electronics' ISSP Structured ASIC Platform
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
- Faraday Accelerates Software Development for IIoT ASIC with SoReal! 2.0 Virtual Platform
- Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
- Faraday Adopts Synopsys' Platform Architect and Hybrid Prototyping Solutions to Expand Design Services
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |