English
SMIC entered into a US$285 million loan agreement with four Chinese banks
Shanghai, China - January 18, 2004 -- Semiconductor Manufacturing International Corporation (“SMIC”) last week signed a US$285 million loan agreement with four major Chinese banks in Shanghai - Industrial and Commercial Bank of China, China Construction Bank, Bank of Communications and Shanghai Pudong Development Bank.
This US$285 million bank loan will be used to expand the capacity of SMIC’s three 8-inch fabs located in Shanghai and has a repayment period of five years. SMIC is permitted to draw down the loan in stages, which provides SMIC with flexibility in the application of the loan proceeds and helps promote SMIC’s continuous development.
This is the second time that SMIC entered into a loan agreement with these four banks. The first loan agreement of US$480 million was signed in December 2001. This latest loan follows a successful US$630 million private placement of shares by SMIC in September 2003.
About SMIC
As one of the most advanced foundries in China, SMIC provides integrated circuit (IC) manufacturing at 0.35-micron to 0.18-micron and finer line technologies. Established in April 2000, SMIC, a Cayman Islands company, operates three 8-inch fabs engaged in volume production in Shanghai and is constructing a 12-inch facility in Beijing. In May 2003, SMIC's Fab1 was named one of two "Top Fabs of the Year 2003" by Semiconductor International magazine, a leading industry publication. In addition to IC manufacturing, SMIC provides customers with a full range of services, including design services, mask manufacturing and testing. All three of SMIC’s fabs in Shanghai have obtained ISO9001 and ISO14001 certifications for high service quality and environmental protection standards. The three fabs have also been certified under the OHSAS18001 standard for health and safety. For more information, please visit www.smics.com.
This US$285 million bank loan will be used to expand the capacity of SMIC’s three 8-inch fabs located in Shanghai and has a repayment period of five years. SMIC is permitted to draw down the loan in stages, which provides SMIC with flexibility in the application of the loan proceeds and helps promote SMIC’s continuous development.
This is the second time that SMIC entered into a loan agreement with these four banks. The first loan agreement of US$480 million was signed in December 2001. This latest loan follows a successful US$630 million private placement of shares by SMIC in September 2003.
About SMIC
As one of the most advanced foundries in China, SMIC provides integrated circuit (IC) manufacturing at 0.35-micron to 0.18-micron and finer line technologies. Established in April 2000, SMIC, a Cayman Islands company, operates three 8-inch fabs engaged in volume production in Shanghai and is constructing a 12-inch facility in Beijing. In May 2003, SMIC's Fab1 was named one of two "Top Fabs of the Year 2003" by Semiconductor International magazine, a leading industry publication. In addition to IC manufacturing, SMIC provides customers with a full range of services, including design services, mask manufacturing and testing. All three of SMIC’s fabs in Shanghai have obtained ISO9001 and ISO14001 certifications for high service quality and environmental protection standards. The three fabs have also been certified under the OHSAS18001 standard for health and safety. For more information, please visit www.smics.com.
|
||||||
SMIC Hot IP
Related News
- SMIC Shanghai Closed a US$600 Million Syndicated Term Loan
- SMIC seeks $600 million loan in China after U.S. rejection
- TowerJazz Signs Definitive Agreement with Asian Entity to Provide Know-How, Training, and Turnkey Manufacturing Solutions at a Revenue of US $130 Million
- Datang Holdings to Invest US$172 Million in SMIC
- Sequans Announces a New $15 Million Licensing Agreement
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |