Xilinx in talks with IBM to revive foundry deal
Xilinx in talks with IBM to revive foundry deal
By Anthony Cataldo, EE Times
February 11, 2004 (4:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20040211S0039
CARMEL, Calif. Xilinx Inc. is renegotiating a foundry agreement with IBM Microelectronics in an effort to revive a plan for Big Blue to manufacture its FPGAs, said president and chief executive officer Willem Roelandts. The outcome of the talks could determine whether Xilinx will continue to rely on IBM as a second production source for its most advanced FPGAs. The leading programmable logic vendor is now using Taiwan's United Microelectronics Corp. (UMC) for the bulk of its production output, including devices built on 300-mm wafers and its first 90-nm FPGAs, known as Spartan 3. Xilinx wants to maintain its policy of having two foundry sources, but IBM has been slow to ramp up production of its most advanced parts. “We're a little concerned about IBM not having much capacity for us, and that could cause us to look somewhere else,” Roelandts said in an interview during the company's 20th anniversary dinner party here. Maintaining adeq uate production capacity is emerging as a central issue for Xilinx and other chip makers this year as the demand for semiconductors picks up. Xilinx, which began volume shipments of Spartan 3 last month, has indicated that it will not be able to meet early demand for these low-cost FPGAs. Later this year, it plans to introduce its first high-end Virtex FPGAs based on 90-nm design rules. Roelandts said there have been many internal debates about whether to tap other foundries. “We've not made any decision yet but probably it's something we need to look at seriously,” he said. One big problem that IBM is facing is that it isn't pushing through as much volume as UMC, which makes hard to improve yields. IBM “is chasing a galloping horse,” he said. “Every day UMC gets ahead.” One solution Xilinx is proposing is to buy parts from IBM at a lower cost in order to stimulate more production, Roelandts said. Aside from their foundry relationship, IBM and Xilinx are involved in a technology sharing pact that gives Xilinx rights to use IBM's PowerPC architecture and IBM rights to use Xilinx's FPGA fabric.
Related News
- Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard
- Xilinx and IBM to Enable FPGA-Based Acceleration within SuperVessel OpenPOWER Development Cloud
- IBM and Xilinx Announce Strategic Collaboration to Accelerate Data Center Applications
- Will Globalfoundries be More Successful than IBM with Its Foundry Business?
- Xilinx Demonstrates FPGA-Based Acceleration Technology for Next-Generation Data Centers at IBM Impact 2014
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |