TriCN names Mark Goldman VP Sales
SAN FRANCISCO, CA –March 15, 2004 -- TriCN, a leading developer of intellectual property (IP) for high-speed semiconductor interface technology, today announced the appointment of Mark Goldman as Vice President of Sales. A former VP Sales at Cadence, Goldman brings over 25 years of experience in high-tech sales to this strategic position.
Goldman joins TriCN at a pivotal stage that coincides with a series of significant TriCN announcements, including 90nm product support, and introductions of the 1.6 Gb/s GDDR-III graphics interface and the Multi-Function I/O-Memory product, featuring multiple memory interface protocol compatibility. The company is currently readying its PCI-Express product, scheduled for release in Q2 2004.
“We are excited about Mark Goldman leading the TriCN sales team,” commented Joseph Curry, TriCN CEO. “Mark brings a wealth of experience in the IP and EDA world that will be instrumental in accelerating and expanding our sales initiatives domestically and in strategic international markets. In particular, his familiarity and success in the Asian market make him especially well-suited for the position.”
“The TriCN team has earned its reputation as High Performance Interface Specialists,” observed Goldman. ”Their product portfolio and development methodology (with its emphasis on signal integrity) is well-positioned to address the increasingly challenging requirements of high-speed interface design.”
About Mark Goldman
A graduate of American University, Mark Goldman has extensive experience in IP and EDA sales. He most recently worked at Cadence as VP Sales, Western North America region, and has held senior sales positions at CadMOS, Duet Technologies, AVANT!, and Mentor Graphics.
About TriCN
Founded in 1997, San Francisco, California-based TriCN is a leading developer of high- performance semiconductor interface intellectual property (IP). The company provides a complete portfolio of IP for maximizing data throughput on and off the chip. All products are designed using rigorous signal integrity and timing analysis to ensure first time power-up success. Products include Base I/O libraries for pad-ring creation, high-performance memory and networking interfaces, multi-function I/O’s compatible with multiple interface protocols, and multi-gigabit SerDes products. TriCN's customers range from fabless semiconductor to systems companies and independent design manufacturers.
For more information, please visit TriCN’s web site at www.tricn.com.
TriCN: High Performance Interface Specialists™
|
Related News
- Lattice Semiconductor Names Mark Wadlington Corporate Vice President of World Wide Sales
- Sonics Names Mark McMillan as Vice President of Worldwide Sales
- sureCore names Roger Bailey VP Worldwide Sales
- Crossbar, Inc. Names Ron Richter VP of Sales
- GLOBALFOUNDRIES Names New Head of Global Sales and Marketing
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |