NEC Electronics Introduces Industry’s First DVD Recorder Codec IC Integrating 3D Y/C Separator and IEEE 1394 Link Layer Controller
“Our customers are demanding higher versatility and greater cost reductions at the system level to differentiate their DVD recorder products,” said Shigeo Niitsu, general manager, 2nd System LSI Division, NEC Electronics Corporation. "We are proud to bring to market this highly integrated codec IC based on our market-proven system LSI technology and believe it will contribute to a more rapid expansion of the DVD recorder market.”
NEC Electronics’ µPD61181 features a 3D Y/C-capable television (TV) video decoder that suppresses the “cross chrominance” and/or “cross luminance” effects seen in conventional 2D Y/C separation designs and enables high-quality picture recording of analog TVs. The codec IC also provides DV picture recording and storage space-saving advantages. Together with an external IEEE 1394 PHY device, the µPD61181 provides an easy connection for digital AV equipment such as digital-VHS or DV camcorders. Furthermore, through the on-chip DV decoder, it provides such direct media conversion as from DV tapes to DVD discs. The codec IC can also capture video pictures from digital AV equipment for storage on a DVD or the DVD recorder’s HDD. In addition, the product features set top box (STB) functions and ensures compliance with all major digital broadcasting standards.
By effective integration and the unified memory technology, the µPD61181 architecture also makes it possible to eliminate the needs for five LSI devices and simplify system configurations, resulting in smaller footprints and lower overall costs.
About NEC Electronics DVD Recorder Solutions
In April 2003, NEC Electronics introduced its µPD61171 LSI DVD recorder codec and its µPD61171 software development tool kit. The µPD64011B TV video decoder, with 3D Y/C separation capability, and the µPD72891B/72893B LSI DV codec, incorporating an IEEE 1394 link layer controller, have earned broad market acceptance.
Availability
Engineering samples of the µPD61181 are available now. Mass production is scheduled to start in October 2004 with monthly production volumes expected to reach 500,000 units by April 2005. Availability is subject to change.
About NEC Electronics Corporation
NEC Electronics (TSE: 6723) worldwide specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 24 subsidiaries worldwide including NEC Electronics America, Inc. (www.necelam.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). In addition to marketing, selling and supporting NEC Electronics products to customers in their respective regions, NEC Electronics America and NEC Electronics Europe also operate local manufacturing facilities in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC Electronics America for North America and NEC Electronics Europe for Europe are the sales and marketing channels of NEC AM-LCD and PDP modules. For additional information about NEC Electronics worldwide, visit www.necel.com.
###
|
Related News
- DapTechnology's 1394b FireLink Extended IP boosts download performance on Ampex MiniR700 Solid State Data Recorder
- Silicon Interfaces announces its OVM Based IEEE 1394 Link Layer Controller Verification IP
- Agilent Technologies to Demonstrate Industry-First USB 3.0 Tests with NEC Electronics’ USB 3.0 Host Controller
- NEC Electronics Introduces World's First USB 3.0 Host Controller
- Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |