Chip Express, the Structured ASIC Leader, Raises $12 Million in Funding, Unveils New Name
As ChipX, the Structured ASIC Leader Continues Driving Technical Innovation and New Product Development
Santa Clara, CA – March 22, 2004 - Chip Express, the Structured ASIC leader, today announced that it has secured $12 million in additional financing from investment firms and corporate partners. The funding will be used for R&D investments in the company’s Structured ASIC technology. The company also announced that it has changed its name to ChipX in order to more strongly identify with the Structured ASIC market, which is undergoing significant growth and displays tremendous potential.
The funding round was led by a new investor, VantagePoint Venture Partners, and included former investors Elron Electronic Industries, Ltd. (NASDAQ: ELRN), Wasserstein Venture Capital, UMC (NYSE:UMC), Needham Capital Partners, Newlight Associates, Parker Price Venture Capital, and Insite Capital.
Doron Birger, President and CEO of Elron, has been appointed Chairman of the ChipX Board of Directors, replacing founding chairman Uzia Galil, who has stepped down. Melissa Crane Guzy, Managing Director of VantagePoint Venture Partners, also joins the ChipX board as a new director.
"There is a direct correlation between shrinking silicon geometries and the benefits of using Structured ASIC technology to shorten prototyping and reduce NRE costs," said Amnon Fisher, ChipX President and CEO. "As line widths decrease, mask costs and design complexity increase exponentially, forcing OEMs to look for new methods for high-performance ASIC design. We are uniquely positioned to take advantage of these market trends."
"ChipX has broadened its structured ASIC product portfolio and now offers a true alternative to standard cell ASICs for most developers. We believe that this is an important step forward for the industry," said Guzy.
"With the new financing, the addition of Vantage Point Venture Partners as a strong shareholder, and with Amnon Fisher as a new CEO, ChipX will establish itself as the Structured ASIC leader by driving the technology to ever-higher performance levels," said Birger.
Structured ASICs are a new category of semiconductors targeted at developers who are looking for the fast-turn capabilities of FPGAs without their high unit cost, and those who want to take advantage of the relatively low unit costs of ASICs without paying high NREs. Structured ASIC devices reduce much of the up-front NRE and shorten development time by using pre-diffused transistors and metal layers to implement logic cells, memory, and I/O common to many designs. Custom logic for a specific application is then implemented in the final few layers of metal, requiring far fewer mask layers for each design.
About ChipXChipX, formerly known as Chip Express, is a leading manufacturer of late-stage programmable application-specific integrated circuits, or Structured ASICs. The company's innovative, patented technology consolidates wafer production tooling, reduces time-to-market and minimizes the cost of initial production. ChipX Structured ASIC technology is widely used in automotive telematics, computing peripherals, communications, high-end consumer electronics, industrial control, medical equipment and military/aerospace systems.
Headquartered in Santa Clara, CA, ChipX is a privately held corporation, founded in the U.S. in 1989. A subsidiary, ChipX (Israel) Ltd., performs Research & Development. Investors include Elron Electronic Industries, Ltd., VantagePoint Venture Partners, Wasserstein Venture Capital, Newlight Associates, Parker Price Venture Capital, UMC, Needham Capital Partners and Insite Capital.
About VantagePoint Venture Partners
VantagePoint Venture Partners is one of the nation's largest venture capital firms that actively works with management teams and its strategic partners to build technology leaders. As an active multi-stage investor, the Firm provides funding and resources for all stages of a company’s lifecycle from seed round through late stage and privately negotiated investments in public companies. Founded in 1996, VantagePoint has more than $2.5 billion in committed capital in four funds supported by 27 investment professionals. VantagePoint is based on a full-service ‘Partner-Team’ approach that provides entrepreneurs with a blend of technology, venture capital, operations, marketing, and corporate-finance expertise. The company focuses on technology investments in the communications, semiconductor, and software sectors, as well as related growth industries including CleanTech, healthcare commerce and Internet 3.0. For more information, please visit the VantagePoint website at www.vpvp.com.
|
Related News
- Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields
- Neurala Raises $12 Million to Scale Artificial Intelligence for Industrial Manufacturing
- Microbridge Completes $5 Million Extension Round of Funding From an International Syndicate of Investors, Raises $12.5 Million to Date
- Fabless ASIC startup eSilicon raises $6 million in funding
- Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |