Bluetooth low energy v6.0 Baseband Controller, Protocol Software Stack and Profiles IP
NewLogic Technologies Names New Head of R&D
Axel Jahnke assigned as VP Research and Development
Lustenau, Austria; March 25th, 2004 - NewLogic Technologies, a leading supplier of wireless intellectual property (IP) cores and design services, named Axel Jahnke as Vice President in charge of Research and Development, effective March 2004.
Axel Jahnke joined NewLogic in January 2003 for heading the design center in Munich, Germany. In his new position he will be responsible for developing and leading the activities of all the company's research and development centers and engineering staff.
NewLogic employs more than 180 highly qualified digital, analog and RF engineers based in Lustenau (Austria), Sophia-Antipolis (France), Munich (Germany) and in the recently opened Design Center in Geneva (Switzerland). The company has also subsidiaries in San Jose/US and Singapore.
Axel Jahnke's background includes more than 11 years executive R&D experience in the global semiconductor industry. Before joining NewLogic Axel held R&D management positions at Infineon Technologies and Multilink Technology. He holds a masters degree in Electrical Engineering from the Technical University of Berlin, Germany."Axel's management experience provides significant leadership for our engineering team securing the timely execution of our customer design service projects and our internal IP development", Hans-Peter Metzler, President and CEO, commented."Especially for our WLAN system IP, he will ensure that the company maintains and further expands its technological leadership".
About NewLogic Technologies
NewLogic Technologies, headquartered in Lustenau, Austria, is a leading global supplier of IEEE 802.11 Wireless LAN and Bluetooth intellectual property (IP) cores and next generation cellular technology. In addition NewLogic offers IC design and IP Integration to help its customers achieve their aggressive time to market goals.
|
Related News
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |