CEVA Licenses CEVA-X DSP Architecture to Korea's EoNex to Power 3G Wireless Solutions
Industry's Fastest Licensable DSP Architecture To Power Handset Modem Products for Worldwide 3G Markets
SAN JOSE, CA & KYUNGGI-DO, KOREA - April, 19 2004 - CEVA, Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions, and EoNex Technologies, Inc., a leading Korean mobile solution provider, today announced that EoNex has selected CEVA's new generation CEVA-X architecture to power their next generation enhanced mobile solutions.
CEVA-X is a scalable VLIW-SIMD DSP architecture delivering breakthrough performance, at low power consumption and at lowest cost-of-development for DSP deployment. The CEVA-X1620, licensed to EoNex, is a dual MAC 16-bit fixed point, fully synthesizable DSP core and the best performing DSP on the market today. Independent benchmarks by Berkeley Design Technology (BDTI) confirmed CEVA-X1620 as the industry's fastest licensable DSP core. CEVA-X enables licensees to efficiently develop software using high-level languages such C and C++ allowing re-usability and fast time to market.
EoNex is broadening its mobile product portfolio for their worldwide mobile customer base. EoNex has successfully developed the N1000, cdma2000 1x modem, and the N3000, the world's first WCDMA/cdma2000 1x dual mode modem. Powered by the CEVA-X DSP, EoNex will expand its product line to include enhanced multimedia features. These chips, the N1100 1x EV-DO modem and the N3100 WCDMA/1x EV-DO dual mode modem, feature A/C-GPS, 128-poly MIDI, and other multimedia capabilities. Using the power of CEVA-X, EoNex can integrate GPS and multimedia applications. Furthermore, EoNex plans to release the universal modem supporting the entire worldwide wireless standards of W-CDMA, cdma2000, and EGPRS in Q1 2005.
"CEVA-X, a groundbreaking technology which provides superior DSP performance and scalability, allows EoNex to develop high-performance, power-efficient chip solutions that support multimedia applications," said Don Kim, VP of Business Planning. "EoNex and CEVA have successfully worked together in the past in DSP technology, and we will be able to provide enhanced modem chips for mobile applications using the new CEVA-X DSP architecture."
"Our partnership with EoNex further expands our wireless presence in the rapidly growing 3G and multimedia markets," said Gideon Wertheizer, EVP of CEVA. "We are confident that the adoption of the CEVA-X will further extend CEVA's position as the leading licensor of DSP to the industry."
About EoNex
EoNex Technologies Incorporated (www.eonex.com) provides modem chip and protocol software solution for CDMA, GSM and 3G WCDMA wireless terminals. The company provides the timely delivery of cost- and performance- effective wireless terminal products. EoNex, founded in Korea in 2000, provides a complete product line-up for 2G (GSM, IS95-A/B), 2.5G (EGPRS, cdma2000 1x) and 3G (WCDMA, 1x EV-DO) modems. These modem solutions are tightly integrated into dual-mode or triple-mode combo solutions to make possible the service transition of 2G to 3G in different market segments around the globe.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
|
Ceva, Inc. Hot IP
Related News
- RadioFrame Networks License CEVA-X DSP Core and Subsystem to Power Femtocell 2G/3G Wireless Base Stations
- Spreadtrum Utilizes CEVA-X DSP to Develop TD-SCDMA Baseband Processors for 3G Wireless Handsets
- CEVA Low Power DSP Core Enables EoNex Modem Chip, Korea's First for CDMA2000 1x Wireless Phones
- Atmel Licenses Industry-Leading CEVA-X DSP And System Platform To Power Next-Generation High Performance Storage Applications
- Samsung Licenses CEVA's Newest Generation CEVA-X DSP Core
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |