Fabless Semiconductor Association (FSA) Announces Six Percent Price Increase for 0.13-Micron Process Technology

FSA Releases Back-End Pricing Survey Results In “Q1 2004 Wafer Fabrication & Assembly/Test Report”

SAN JOSE, Calif. (April 21, 2004) – The Fabless Semiconductor Association (FSA), a premier semiconductor trade association, today announced the results of its quarterly “Wafer Fabrication and Assembly/Test Pricing Survey,” analyzing the average price paid per wafer by 129 fabless companies and integrated device manufacturers (IDMs). The “Q1 2004 Wafer Fabrication & Assembly/Test Report” indicates that average prices for wafers using 0.13-micron process geometry increased six percent from Q3 2003 to Q1 2004.

The majority of participants ordered 0.18-micron process geometry, with more than 27 percent of fabless participants and 22 percent of IDMs ordering wafers using this process geometry. Additionally, in Q1 2004, 12 percent of fabless wafer orders included 0.13-micron process geometry, compared to 10 percent of all IDM orders placed for the same process.

The survey results provide detailed insight into average unit wafer costs (150mm, 200mm and 300mm) using factors such as process geometry, number of metal layers, wafer process, number of poly layers and epitaxial/non-epitaxial processes.

A new section was added to the survey this quarter to specifically address assembly and test issues. Participant responses indicate that fabless companies, on average, pay more for outsourced back-end services than IDMs. Fabless companies pay 36 percent more than IDMs for assembly services when including package family, leads and units per week. Test service prices are 59 percent higher for fabless companies than IDMs when test segment, signal pin count, digital data rate and units per week are evaluated.

To ensure confidentiality, data was collected and tabulated by Ernst & Young LLP, using a weighted industry average approach. Access to detailed survey results can be purchased via the FSA Web site at www.fsa.org/store.

About the Fabless Semiconductor Association:
The FSA is the global voice of fabless and hybrid semiconductor companies and their foundry and supply chain partners. Incorporated in 1994, the Association (www.fsa.org) is focused on the perpetuation of the fabless business model throughout the worldwide semiconductor industry. The organization encourages the relationship between semiconductor companies and suppliers; facilitates business partnerships; creates awareness of the fabless/outsourced business model; disseminates industry data; and fosters standards and policies.

FSA members include fabless companies, integrated device manufacturers (IDMs), foundry providers, packaging/assembly houses, intellectual property providers, electronic design automation companies, OEMs, photomask companies, design software companies, investment bankers, venture capitalists and other companies. FSA members represent more than 21 countries spanning North America, Asia-Pacific, Europe and the Middle East.

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