Xyalis offers unprecedented capabilities with its new GTmuch V6.0, multi-project wafer preparation and management system
Mask costs in the latest technologies become a key issue. This leads in new challenges in managing huge and heterogeneous databases. For prototyping, the adoption of MPW program allows dramatic cost saving by sharing these costs among multiple projects.
GTmuch
GTmuch is a specific tool for building and managing multi-project wafers masks. It provides advanced features to support complex reticule assembly constraints. GTmuch includes GDSII contributions validation prior database merging with name conflict resolutions, automatic placement optimization under parameterizable criteria, automatic metal-filling, final checks and MPW GDSII generation.
In addition to run time performance enhancements, this new release brings a new fully parameterizable graphic interface, and still, offers advanced scripting capabilities for process automation.
With this new version, GTmuch V6.0, now offer import/export capabilities based on industry standard XML format. User can interface with his preferred SQL compatible database and/or WEB based information system using simple standard procedure.
GTmuch generates a complete set of documentation in PDF or PS format for the different teams involved in the multi-project wafer such as reticule floorplan for designers, chip assembly/packaging resources as well as silicon area utilization for purchasing/billing department.
Availability
GTmuch is shipping today on 32-bit Linux, and 32-bit and 64-bits Solaris, HP-UX platforms. GTmuch price starts at $30.000 per year.
About Xyalis
XYALIS is a privately held company, founded in 1998, and located in Grenoble, France. XYALIS is the leading specialist in layout finishing and GDSII processing software. (www.xyalis.com)
|
Related News
- Europractice and UMC Offer 90nm Multi-Project Wafer Prototyping and Production Service
- SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
- New automated online multi-project wafer quote system delivers instant pricing
- EnSilica teams with BaySand to provide ASIC UltraShuttle-65 multi-project wafer customers with configurable IP solutions
- BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |