English
TSMC Board of Directors Approves Capital Appropriation for Expanding Capacities
May 11, 2004 - Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) (NYSE: TSM) today held a meeting of the Board of Directors, at which the Board approved a capital appropriation of projects in the amount of approximately US$1.4 billion to expand its manufacturing capacity in response to increasing customer demand.
TSMC Spokesperson and CFO Ms. Lora Ho noted that, at its meeting, the Board of Directors:
1. Approved a capital appropriation in the amount of US$67.3 million to expand the capacities of its 6-inch and 8-inch fabs by a total of 15,600 8-inch equivalent wafers per month.
2. Approved a capital appropriation in the amount of US$1,334 million to expand the capacity for its 90nm copper process at Fab 12 by 14,000 12-inch wafers per month.
TSMC Spokesperson and CFO Ms. Lora Ho noted that, at its meeting, the Board of Directors:
1. Approved a capital appropriation in the amount of US$67.3 million to expand the capacities of its 6-inch and 8-inch fabs by a total of 15,600 8-inch equivalent wafers per month.
2. Approved a capital appropriation in the amount of US$1,334 million to expand the capacity for its 90nm copper process at Fab 12 by 14,000 12-inch wafers per month.
|
||||||
Related News
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |