VeriSilicon and Denali Team to Deliver DDR Memory Interface Solutions for China-based Wafer Foundries
Announcement Made During Denali MemCon Boston
DENALI MEMCON BOSTON, WESTFORD, Mass., May 13, 2004--VeriSilicon Holdings Co., Ltd., the leading intellectual property (IP) and design service provider for China-based wafer foundries, and Denali Software today announced a partnership to provide silicon-proven memory interface solutions for those foundries. This announcement is being made during Denali MemCon, the yearly forum for exchanging information about semiconductor memory and PCI Express technology, hosted by Denali, provider of electronic design automation (EDA) solutions for chip interface design and verification.
Through the partnership, VeriSilicon and Denali will develop a series of integrated, process-specific memory interface IP that incorporates VeriSilicon's production-proven standard cell library and high speed IO interfaces with Denali's Databahn DDR memory controller IP. It will allow designers to access silicon-hardened SDRAM/DDR1, mobile DDR1, DDR1/DDR2 memory controllers and future memory interface-based IP. Having a proven GDSII core and all associated design views will reduce risk and the cost of support. It also will accelerate time to market with higher quality end products that meet timing and functionality in a single silicon pass.
"Denali is the acknowledged industry leader in high-performance memory solutions," notes Wayne Dai, President and CEO of VeriSilicon Holdings. "We are excited about working with Denali and the ability to include integrated DDR solutions in our extensive IP catalog for all major China based wafer foundries, such as SMIC, GSMC, HHNEC and ASMC. This partnership also enhances VeriSilicon's deep submicron design service capability for a variety of DDR related applications."
"We’re pleased to be able to help our customers reduce risk and overall development time through our alliance with Rambus," said Mike McKeon, director of strategic products at Denali. "Denali’s silicon-proven Databahn controllers, combined with Rambus’s interface cells, is ideal for customers who need maximum speed and reliability, and minimum design risk for their memory interfaces."
Mark Gogolewski, chief technology officer (CTO) of Denali Software adds: "We see great opportunities in China for semiconductor design and manufacturing. VeriSilicon is emerging as the leading provider of hard IP and ASIC design foundry services for China fabs and has an impressive track record of silicon successes. We are excited to work together to provide a common solution for our customers. Hardening Denali's IP by VeriSilicon will provide customers with an off-the-shelf solution for DDR memory systems that is cost effective and high quality."
About VeriSilicon Holdings Co., Ltd.
VeriSilicon is a leading application specific integrated (ASIC) design foundry focusing on providing IP, design services and turnkey solutions for China-based wafer foundries. It has operation centers in China (Shanghai), Taiwan (Neihu) and the United States (Silicon Valley) to service worldwide customers. VeriSilicon offers Standard Design Platforms including standard cell libraries, IO cell libraries, memory compilers, and analog solutions. For more details, visit: www.verisilicon.com.
About Denali Software, Inc.
Denali Software Inc. is the world's leading provider of electronic design automation (EDA) software and Semiconductor Intellectual Property (SIP) solutions for chip interface design, integration, and verification. More than 400 companies worldwide use Denali's tools, technology, and services to design and verify complex chip interfaces for communication, consumer, and computer products. Corporate headquarters are located at: 1850B Embarcadero Road, Palo Alto, Calif. 94303. For more information, visit Denali at www.denali.com. Or, contact Denali by phone at: (650) 461-7200, or email: info@denali.com.
The Denali logo, Databahn, eMemory, MMAV, and PureSpec are trademarks of Denali Software Inc. RPCI Express is a trademark of PCI-SIG. All other registered trademarks and other trademarks that may be mentioned in this release belong to their respective owners.
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