English
Conexant chairman: Fabless IC designers face rising design costs
by LR Huang, Shanghai; Adam Hwang, DigiTimes.com
The biggest challenge fabless IC design houses face in the future will be the increasing cost of IC design, indicated Conexant Systems chairman and Fabless Semiconductor Association (FSA) vice chairman Dwight Decker, at the IC Industry Development Forum held on April 22 in Shanghai, China.
Related News
- Global Top 10 IC Designers' 2019 Revenues Drop by 4.1% YoY, as Industry Growth to Face Challenges from COVID-19 Pandemic in 2020, Says TrendForce
- IC designers leave Graphcore for Meta
- Automotive IC Marketshare Seen Rising to 10% by 2026
- Fabless Suppliers Hold Record 34.8% Share of Global IC Sales
- Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion
Breaking News
- Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
- Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
- AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
- Post-Quantum Cryptography: Moving Forward
Most Popular
- Intel Announces Retirement of CEO Pat Gelsinger
- Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
- Arteris Deployed by Menta for Edge AI Chiplet Platform
|
E-mail This Article | 
|
|
Printer-Friendly Page |