TransDimension joins WiMedia Alliance and extends its peripheral connectivity strategy into Wireless connectivity
Focus to Leverage TransDimension's USB Wired Connectivity Capabilities into Wireless Peripheral Connectivity
IRVINE, Calif., June 2, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that it has joined the WiMedia Alliance, an industry alliance focused on Ultra Wideband (UWB) wireless connectivity, as part of TransDimension's extension of its USB wired peripheral interconnect strategy into wireless peripheral connectivity semiconductor and software solutions.
"TransDimension believes that UWB will be the wireless standard for peripheral interconnectivity. Much of the same capability that TransDimension uses to enable USB wired connectivity applies to wireless connectivity solutions," said Michael Holt, TransDimension vice president of marketing and business operations. "We develop integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of applications and mobile devices, without ties to a PC. Wireless connectivity is a critical aspect of our strategy and a natural extension for the company."
TransDimension's product lines include ICs (semiconductors), USB function blocks for integration into larger system-on-chip solutions and software that provide direct connectivity for a wide range of PC peripheral, consumer and mobile devices that until now have required an indirect means, such as a PC host, to exchange data. These embedded applications include cellular phones, set top boxes, printers, PDAs, digital cameras, portable storage products and CD, DVD and MP3 players.
"UWB connectivity is a natural extension to TransDimension's leadership in USB connectivity solutions," commented Glyn Roberts, president of the WiMedia Alliance. "TransDimension can play an important role in the standardization of UWB. We are glad to have TransDimension's participation."
About WiMedia
The WiMedia Alliance is a not-for-profit open industry association formed to promote personal-area range wireless connectivity and interoperability among multimedia devices in a networked environment. The Alliance develops and adopts standards-based specifications for connecting wireless multimedia devices including application, transport, and control profiles; test suites; and a certification program to accelerate widespread consumer adoption of "wire-free" imaging and multimedia solutions. For more information, go to www.wimedia.org.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity and I/O for a wide range of applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at www.transdimension.com.
|
Related News
- Tensilica Joins Wi-Fi Alliance to Provide Wireless Multi-Standard Modem Solutions
- CEVA, Inc Joins Wi-Fi Alliance to Further Advocate for a Software-based Wi-Fi Strategy
- Transdimension announces acquisition of peripheral connectivity property and product portfolio from ARC International
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
- EnSilica joins TSMC Design Center Alliance
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |