Design costs for complex chip architectures reaching $100 million
EE Times: Latest News Design costs for complex chip architectures reaching $100 million | |
Mark LaPedus (06/18/2004 1:00 PM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=22100767 | |
PALO ALTO, Calif. The overall development cost for a new chip architecture continues to skyrocket, with some next-generation designs are running $100 million each, according to a Texas Instruments Inc. executive. Gene Frantz, Principal Fellow at TI, said it is somewhat misleading to say that overall IC design costs are running $20 million or more per product. In reality, total development cost for a new, complex chip architecture is running at about $100 million per product, Frantz said. Overall cost includes the design, user guides, support and other items, he said. Frantz added there are vast changes taking place in terms of developing new chip architectures. So what's driving up overall IC design costs? "The era of [instruction-set architectures] is over," Frantz said. "Innovation has left the silicon. The focus is what runs on top the silicon," he told Silicon Strategies at the 3i iSight Semiconductor Event on Thursday (June 17). The event was co-sponsored by venture capital firm 3i Corp. and the Fabless Semiconductor Association. The TI technologist was referring to the protocol stacks, software programmability and related functions, which have become key parts in overall chip design.
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |
Related News
- Rambus Initiates $100 Million Accelerated Share Repurchase Program
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
- SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility
- Cadence Announces $100 Million Accelerated Share Repurchase Agreement
- CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |