Lattice Semiconductor Demonstrates Wireless Base Station Interface

HILLSBORO, OR - August 18, 2004 - Lattice Semiconductor Corporation (NASDAQ: LSCC), with Tyco Electronics, has successfully demonstrated a complete solution for the Open Base Station Architecture Initiative (OBSAI) Reference Point 3 (RP3) interface.

The OBSAI architecture partitions the Base Station into four modules: the RF Module, the Baseband Module, the Control and Clock Module and the Transport Block Module. The RP3 specification addresses the interface between the Baseband and the RF Modules utilizing OBSAI-defined packets and a high-speed serial link. The data rates on this link can run at either 768Mbps or 1.536Gbps, and the physical layer PCS must support 8b/10b encode/decode. The RP3 interface defines a point to point serial interface for the transfer of data and control in a four layer protocol consisting of a Physical Layer for serialization and coding of the data, a Data Link Layer for message framing, a Transport Layer for routing and the Application Layer that provides mapping of the various packet types to the payload.

The Lattice/Tyco demonstration, given in conjunction with an August 17 OBSAI members meeting in Oxford, UK, is an integrated and complete solution. It provides soft IP (intellectual property) implemented in FPGA gates to address data link layer functionality, while utilizing the industry-leading embedded SERDES and PCS core of the device to fulfill the physical layer requirements for the communication of RP3 packets over Tyco's unique backplane connector for slim slot spacing and/or high speed cable assembly.

"Lattice Semiconductor was one of the first semiconductor companies to become part of the OBSAI Alliance. The successful demonstration of this implementation of the OBSAI Reference Point 3 specification is a further step towards establishing the OBSAI specifications within the industry," said Jukka Klemettila, OBSAI Chairperson.

Lattice Field Programmable System Chip Used As Platform

The target platform chosen by Lattice Semiconductor for the reference design was the ORT42G5, a Field Programmable System Chip, or FPSC. This device has sufficient FPGA gates to accommodate the soft IP portion of the design, while also providing physical layer functionality with its advanced embedded SERDES + PCS capability. The embedded ASIC technology supports very low power consumption of 225mW per channel, including the input-output buffers, and can accommodate both the 768Mps and 1.536Gbps of the OBSAI specification by simply changing a register setting. For ease of use, the device was mounted on a Lattice standard evaluation board.

Tyco Electronics, using either a 2mm HM 4+1 row connector with Line Card and Backplane assembly, or a 1mm GIGA I/O cable assembly, provided the physical interconnection channel. Tyco's high-speed cable was used to transmit error-free data over a distance of 8 meters. The backplane demonstration also showed data being transferred across an FR4-based test vehicle 1500cm long, assembled with 2mm HM 4+1 row (slim).

"Over the past few years Lattice Semiconductor and Tyco Electronics have established a close relationship," said Stan Kopec, Lattice vice president of corporate marketing. "The need to solve the problems associated with the error-free transmission of high-speed signals across backplanes and cable assemblies means that close cooperation between the electronics component vendors and connector suppliers is critical for success. The electrical properties of connectors and sockets, and their interaction with active components, have a significant effect on signal integrity, which is critical to system performance and must be considered in the early phase of any design."

Doron Lapidot, Director Circuit & Design, Tyco Electronics, Asia/Pacific & EMEA, said, "Tyco Electronics Circuit & Design engineers have characterized the total interconnect comprised of common FR4 material, 2mmHM 4+1 row (slim version) connectors and the Lattice ORT42G5 backplane FPSC as an active interconnect. The correlation between measured eye-pattern and simulated eye pattern was very close. Consequently, we've demonstrated the capability to predict signal integrity obstacles with greater than 95% accuracy, and rectify them before a system is built in order to achieve robust system interconnect performance at 1.536Gbps and beyond."

About the Open Base Station Architecture Initiative

The Open Base Station Architecture Initiative (OBSAI) is comprised of some 70 industry-leading telecommunications companies. OBSAI has created a set of open specifications to define modular wireless base station architecture, and detailed specifications for the three main internal interfaces. The objective of the initiative is to create an open market for base station modules and components to reduce development effort and cost, improve time to market and accelerate the implementation of new and advanced services. For more information, visit www.obsai.org

About Tyco Electronics

Tyco Electronics is the world's largest passive electronic components manufacturer; a world leader in cutting-edge wireless, fiber optic and complete power systems technologies; and is rapidly developing extensive networking and building technology installation services. Tyco Electronics provides advanced technology products from over forty well-known and respected brands, including Agastat, Alcoswitch, AMP, AMP NETCONNECT, Buchanan, CII, CoEv, Critchley, Elcon, Elo TouchSystems, M/A-COM, Madison Cable, OEG, OneSource Building Technologies, Potter & Brumfield, Raychem, Schrack, Simel and TDI Batteries.

Access the Tyco Electronics World Wide Web site at http://www.tycoelectronics.com/; for further information about modeling and simulation, visit http://www.amp.com/simulation/default.stm

About Lattice Semiconductor

Lattice Semiconductor Corporation designs, develops and markets the broadest range of Field Programmable Gate Arrays (FPGA), Field Programmable System Chips (FPSC) and high-performance ISP™ Programmable Logic Devices (PLD), including Complex Programmable Logic Devices (CPLD), Programmable Analog Chips (PAC™), and Programmable Digital Interconnect (GDX™). Lattice also offers industry leading SERDES

products. Lattice is “Bringing the Best Together” with comprehensive solutions for today's system designs, delivering innovative programmable silicon products that embody leading-edge system expertise.

Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in the fields of communications, computing, computer peripherals, instrumentation, industrial controls and military systems. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124-6421, USA; telephone 503-268-8000, fax 503-268-8037. For more information about Lattice Semiconductor Corporation, visit http://www.latticesemi.com.

Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties including market acceptance and demand for our new products, estimates of market size and growth rate, our dependencies on our silicon wafer suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements.

Lattice Semiconductor Corporation, Lattice (& design), L (& design), GDX, ISP, PAC and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

TYCO Electronics and TYCO logo are trademarks of TYCO in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.