English
SIDSA announces the new "CARMeN-II" ARM emulation board for SoC Development &Validation
Fast, single board ARM SoC prototyping environment for hardware / software co-design
Tres Cantos, Spain, September 6st,2004 – SIDSA (Semiconductor Research and Development), a leading European provider of SoC design services and multimedia products, today announced a new ARM Design platform called “CARMeN-II”. Based on SIDSA’s proven line of ARM emulation products, it allows fast prototyping of large ARM-based ASICs on a single Xilinx XC2V6000 or XC2V8000 with physical interfaces to many peripherals such as Ethernet, USB, PCMCIA, smarcard, PCI, UART, CAN
Overview
Although ARM cores are today a widely used “de-facto” standard , development costs and time-to-market are considerable for custom ASICs or SoC (System on Chip) and new skills are required for hardware and embedded software design
Solutions
SIDSA’s seven years knowledge of ARM design is embodied into the “CARMeN-II” board. This fourth generation product combines SIDSA’s and customers’ experience in SoC design. Using the “CARMeN-II”, rather than relying on simulation only, ARM based designs can be quickly mapped into the emulation boards and debugged. This methodology is ideal for software / hardware partitioning and co-design. The embedded software can be fully verified in the target environment before and during IC tape-out.
As well as the on-board ARM7TDMI core, other cores and header cards are now available from SIDSA such as ARM720, ARM940/9TDMI, ARM920, ARM946.
When the decision is taken to product the ASIC, the same netlist can be given to a design house or foundry for the SoC place and route. As the ARM core is available in most silicon foundries, the decision to choose the component supplier can be taken at the end of the development cycle.
Availability and Pricing
Shipping, 1 to 2 weeks delivery time.
Prices, starting from 14k EUR (17.5k USD).
Tres Cantos, Spain, September 6st,2004 – SIDSA (Semiconductor Research and Development), a leading European provider of SoC design services and multimedia products, today announced a new ARM Design platform called “CARMeN-II”. Based on SIDSA’s proven line of ARM emulation products, it allows fast prototyping of large ARM-based ASICs on a single Xilinx XC2V6000 or XC2V8000 with physical interfaces to many peripherals such as Ethernet, USB, PCMCIA, smarcard, PCI, UART, CAN
Overview
Although ARM cores are today a widely used “de-facto” standard , development costs and time-to-market are considerable for custom ASICs or SoC (System on Chip) and new skills are required for hardware and embedded software design
Solutions
SIDSA’s seven years knowledge of ARM design is embodied into the “CARMeN-II” board. This fourth generation product combines SIDSA’s and customers’ experience in SoC design. Using the “CARMeN-II”, rather than relying on simulation only, ARM based designs can be quickly mapped into the emulation boards and debugged. This methodology is ideal for software / hardware partitioning and co-design. The embedded software can be fully verified in the target environment before and during IC tape-out.
As well as the on-board ARM7TDMI core, other cores and header cards are now available from SIDSA such as ARM720, ARM940/9TDMI, ARM920, ARM946.
When the decision is taken to product the ASIC, the same netlist can be given to a design house or foundry for the SoC place and route. As the ARM core is available in most silicon foundries, the decision to choose the component supplier can be taken at the end of the development cycle.
Availability and Pricing
Shipping, 1 to 2 weeks delivery time.
Prices, starting from 14k EUR (17.5k USD).
|
||||||
Related News
- SIDSA announces the "ADAC" ARM Automobile Design Platform for SoC Development Validation
- Andes Technology Announced the QiLai SoC and the Voyager Development Board
- Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
|
E-mail This Article | 
|
|
Printer-Friendly Page |