Adaptive Clock Generation Module for DVFS and Droop Response
NewLogic sees growth in market for integration of Bluetooth in System on Chip (SoC) devices
The NewLogic BOOST(tm) Bluetooth baseband processor is designed in a modular way, which enables it to be easily integrated into SoC's. This has enabled NewLogic to emerge as the No.1 supplier of Bluetooth basebands for SoC designs. The baseband is also designed to be processor independent and whilst most customers integrate it with an ARM CPU, the baseband can also work with other CPU's and with proprietary processor cores. NewLogic's BOOST(tm) IP family includes the Bluetooth baseband processor, a full Bluetooth software protocol stack and a Bluetooth CMOS radio. These IP elements meet SoC design demands including small size, the ability to be integrated into current and future platforms, and scalability.
"The initial market for Bluetooth IP was mainly to semiconductor companies who wanted fast market entry with standalone Bluetooth IC's," commented Chris Eden, Marketing Director, responsible for NewLogic's Bluetooth IP product range. "These devices were then used in a range of first generation Bluetooth enabled products. Where these products have successfully entered volume production and for second generation products, manufacturers are cost reducing their bill of materials (BoM) by integrating Bluetooth into the main system ASIC. This approach can also reduce the number of memory devices and provide other performance advantages."
About NewLogic Technologies
NewLogic is headquartered in Lustenau, Austria, and is a leading global supplier of IEEE 802.11 Wireless LAN, Bluetooth intellectual property (IP) cores and other elements for the next generation cellular technology. A significant part of the business is providing analog and digital IC design services where the company has a wide range of expertise, including experience in developing 90nm IC Designs.
The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by NewLogic is under license. Other trademarks and trade names are those of their respective owners.
|
Related News
- Cadence Expands System and SoC Verification Offerings to Accelerate System Integration and Reduce Time to Market
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
- RISC-V Sees Significant Growth and Technical Progress in 2022 with Billions of RISC-V Cores in Market
- Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market
- INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash
Breaking News
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
- BrainChip Gives the Edge to Search and Rescue Operations
- Shifting Sands in Silicon by Global Supply Chains
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Intel Announces Strategic Investment by Silver Lake in Altera
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- AMD Achieves First TSMC N2 Product Silicon Milestone
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |