NEC Electronics Announces New High Performance MPEG Decoder for Integrated Digital Televisions, Supporting Digital and Digitised Analogue Signals
The µPD61123 integrates two MIPS32® 4KE™ microprocessor cores capable of delivering speeds of up to 300 MIPS each. The device also offers an improved DDR-SDRAM interface, with speeds of up to 166MHz and up to 1GB of memory volume. With the enhanced graphics engine, designers now have even more flexibility to handle advanced graphics and data manipulation. The combination of these performance-enhancing features enables outstanding speed of MHEG interactive applications, smooth operation of MHP, and integration of the standard on-screen display functions.
To provide complete support for iDTV, the µPD61123 includes an output for high-end flat panel displays. The device can simultaneously decode and output two MPEG audio streams, an essential function for support of Audio Descriptor services which are a part of DTT standards in the U.K. An embedded USB1.1 host interface permits connection to external devices such as digital cameras, and direct support for DVB-CI eliminated the need for external routing chips. Notwithstanding these functions, the device has comprehensive power management coupled with a design process optimised for low power operation.
The uPD61123 is supported by a range of software and middleware, including reference designs, evaluation systems and a full suite of high level application program interfaces (APIs) and wrappers, compatible across the whole range of NEC Electronics’ digital AV devices. API and key middleware applications, including MHEG and soon MHP, will be provided by a Europe-based support team.
Availability
Volume production is scheduled to begin in spring 2005. Availability is subject to change.
MIPS32® 4KE™ is a trademark or registered trademark of MIPS Technologies Inc. All other trademarks or registered trademarks are the property of their respective trademark owners.
About NEC Electronics Corporation
NEC Electronics (TSE: 6723) worldwide specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. (www.necelam.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). In addition to marketing, selling and supporting NEC Electronics products to customers in their respective regions, NEC Electronics America and NEC Electronics Europe also operate local manufacturing facilities in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC Electronics America for North America and NEC Electronics Europe for Europe are the sales and marketing channels of NEC AM-LCD and PDP modules. For additional information about NEC Electronics worldwide, visit www.necel.com.
###
|
Related News
- STMicroelectronics Introduces Full High-Definition Integrated Digital TV Platform Supporting Worldwide Standards
- NEC Electronics America Integrates Analog Copy Protection From Dwight Cavendish Systems Into EMMA-Based MPEG Decoder Devices
- Toshiba, Sony and NEC Electronics Unveil Mass Production Platform Technology for 45nm Generation High Performance System LSI
- Key ASIC Launches ASIC & SoC Design-to-Manufacture Services for Communications and Consumer Electronics Applications; Company Specializes in High Performance, Low Power Mixed-Signal and Digital Design
- Broadcom Introduces an Advanced Dual-Channel AVC/VC-1/MPEG-2 Video Decoder Chip for High-Performance Digital Media Centers
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |