SIDSA announces DVB-H chip and intellectual property for digital television for mobile telephones
SIDSA’s DVB-H solution is available as FPGA prototype hardware for broadcaster field trials; the first IC (chip) is scheduled for 2005
September 10, 2004 -- The DVB-H design implements the COFDM demodulator, MPE-FEC (Multi- Protocol Encapsulation) and advanced power control, essential for television on mobile phones. It provides good communication robustness for all communications conditions.
The company intends to pursue a dual strategy of intellectual property licensing for certain markets and making its own ICs (chips) for other mobile “handheld” digital TV reception applications. SIDSA is one of the few providers of a DVB-H “foundry independent” solution meaning that the DVB-H design block can be implemented by third parties in a chip made in any silicon foundry.
The DVB-H design allows vertical integration with SIDSA’s audiovisual content protection (CAS) products for encrypted television transmissions at transport stream and IP level.
SIDSA (Semiconductors Design Solutions) supplies ICs for DVB digital television reception and provides conditional access software. With offices in Madrid and Silicon Valley, it has been operating for the last 12 years in international markets. SIDSA activities include complete chip design, multimedia products for STB and CAMs based on proprietary chips and content protection software(CAS).
|
Related News
- TTPCom brings television to the mobile with low-power DVB-H Technology
- Imagination Technologies, a leader in system-on-chip intellectual property (IP), announces new IP for DVB-Handheld (DVB-H)
- Abilis Systems' ARC-Based Mobile TV Solution Is World's Smallest DVB-H/T Receiver
- SIDSA launches a state-of-the-art DVB-H demodulator chip
- Silicon & Software Systems (S3) to provide DVB-H Software for Philips TV-on-Mobile Solution
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |