SMIC opens 300-mm wafer fab in Beijing

![]() ![]() | |
EE Times: Latest News SMIC opens 300-mm wafer fab in Beijing | |
(09/27/2004 1:34 PM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=47903119 | |
SAN JOSE, Calif. — Chinese silicon foundry startup Semiconductor Manufacturing International Corp. (SMIC) officially opened its 300-mm fab in a ceremony in Beijing, the company said. SMIC has been processing wafers in the 300-mm fab, known as Fab 4, for some time. Production is slated in the fourth quarter of this year. SMIC said pilot production began in July. The fab will initially produce high-density DRAMs using 0.11- and 0.10-micron process technology, according to an SMIC statement. The Shanghai-based company, China's fast-growing foundry, is sticking to plans to spend $2 billion on capital equipment, but may pull back from plans to spend $1.3 billion in 2005, depending on how the global market develops, according to its chairman, president and chief executive officer (see Sept. 15 story). SMIC also said in a statement that its five fabs in Shanghai, Beijing and Tianjin will be producing 125,000 wafers a month by the end of the year.
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |