HelloVoice™ software suite on OMAP1710 delivers processing optimization of the ARM9 and DSP engine SAN JOSE, CA – October 20, 2004 – HelloSoft, Inc., a leading provider of communication Intellectual Property, and Texas Instruments Incorporated (TI), a world leading designer and supplier of wireless solutions, today announced the availability of HelloSoft’s proven VoIP technology on the TI OMAP1710 platform. Cellular handset providers will be able to combine the processing power of the OMAP1710 with HelloSoft’s HelloVoice software suite to address the increased demand for VoIP applications for next generation handsets.
TI’s OMAP1710 is one of the newest applications processors for cell phones and mobile devices. The OMAP1710 processor offers up to 40 percent improvement in performance for a variety of mobile applications, while consuming as little as half the power of current TI processors. This OMAP engine includes an ARM926EJ-S™ processor, a TI C55x™ DSP engine, as well as a range of software and hardware accelerators for video encode and decode, still picture compression, Java™ and security.
HelloSoft’s world-class VoIP suite running on the ARM926EJ-S core allows the TI DSP engine to be utilized for more complex applications such as video processing. The HelloVoice software suite on the TI OMAP1710 is an enhanced solution including G.711, G.726, G.723.1 and G.729AB vocoders, G.168-2000 Line Echo Canceller, Voice Activity Detection (VAD), Comfort Noise Generation (CNG), Jitter Buffer, Packet Loss Concealment (PLC), DTMF Tone Detection and Generation, Call Progressive Tone (CPT), SIP/RTP/RTCP Call Signalling and Control, and multi-channel system-level framework.
“OMAP1710 is the latest from TI, and has a significant market demand that promises support of next generation applications such as VoIP and video processing,” said Bryce Johnstone, manager of TI’s OMAP Developer Network. “HelloSoft’s solution will provide OEMs with VoIP and video applications on the OMAP1710 for their next generation handsets.”
“OMAP is already a valued application processor for handset providers,” said Krishna Yarlagadda, CEO and president, HelloSoft. “VoIP phone application on the OMAP1710 will assist OEM/ODMs in their next generation handset designs to support dual mode functionality such as converged VoWLAN or VoIP support over GSM/GPRS/3G.”
Availability
The OMAP1710 is available from Texas Instruments. Voice components and protocols from HelloSoft will be available by the end of October 2004.
HelloSoft is a member of TI’s OMAP Developer Network, a group of leading software developers porting advanced applications to TI’s high performance, power-efficient OMAP processors. Handset manufacturers adopting OMAP devices enjoy the rapid deployment of compelling wireless applications – including streaming audio and video, multimedia messaging, gaming, security, speech recognition, location based services and mobile commerce – across all leading operating systems. Systems level integration services are also provided worldwide by independent OMAP Technology Centers. The OMAP platform has been selected by leading manufacturers, such as Nokia, Palm, NEC, Fujitsu, LG Electronics, Hewlett-Packard, Sendo, HTC and many more, for their 2.5 and 3G wireless devices. For more information, please visit www.omap.com.
About HelloSoft HelloSoft, Inc.
HelloSoft licenses customizable Physical Layer and Networking Protocol IP to semiconductor companies and OEMs for Voice-Over-Packet, Wireless LAN, and 2.5G/3G Wireless. HelloSoft’s solutions are provided as a suite of integrated products that include DSP software, Networking software, RTL, a complete reference design and design services to customize these solutions to customer needs. Through this total solutions approach and strategy of offering Software and Hardware IP and engineering services, HelloSoft allows companies to acquire "off-the-shelf" technology that can accelerate new product development in an industry that is driven by complexity, change and innovation. For more information visit www.hellosoft.com.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. All trademarks and trade names used herein are the properties of their respective holders.
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