India moves closer to building a fab

![]() ![]() | |
EE Times: Latest News India moves closer to building a fab | |
K.C. Krishnadas (11/01/2004 11:02 AM EST) URL: http://www.eetimes.com/showArticle.jhtml?articleID=51201791 | |
BANGALORE, India — India's goal of establishing its own chip fab moved a step closer to reality with the launch of study by the government's communications and IT ministry. Feasibility studies aimed at building a silicon foundry to manufacture next-generation wireless chips have already been started, according to Dayanidhi Maran, minister for communications and information technology. He said here on Saturday (Oct. 30) that while top leaders backed an Indian foundry, and that "we are moving in the right direction," he added that its premature to conclude that an Indian foundry is forthcoming. Among other things, the ministry is considering a plan to manufacture RFID devices. India is currently assessing technologies needed to develop a facility to manufacture RFID chips. Talks with undisclosed companies to launch such a facility have begun, but no decisions have been made, Maran said. The plans "are still in the drawing board stage," he said. Since the investments involved are huge — more than $3 billion — India needs to harness the right technology to set up the facility, he added. Earlier, the secretary of India's Planning Commission said it was in talks with Intel Corp. to study the possibility of building a fab in India. The ministry is also in talks with other chip makers, and the government has offered to invest a small amount to put in such a facility.
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
Breaking News
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |