India moves closer to building a fab

![]() ![]() | |
EE Times: Latest News India moves closer to building a fab | |
K.C. Krishnadas (11/01/2004 11:02 AM EST) URL: http://www.eetimes.com/showArticle.jhtml?articleID=51201791 | |
BANGALORE, India — India's goal of establishing its own chip fab moved a step closer to reality with the launch of study by the government's communications and IT ministry. Feasibility studies aimed at building a silicon foundry to manufacture next-generation wireless chips have already been started, according to Dayanidhi Maran, minister for communications and information technology. He said here on Saturday (Oct. 30) that while top leaders backed an Indian foundry, and that "we are moving in the right direction," he added that its premature to conclude that an Indian foundry is forthcoming. Among other things, the ministry is considering a plan to manufacture RFID devices. India is currently assessing technologies needed to develop a facility to manufacture RFID chips. Talks with undisclosed companies to launch such a facility have begun, but no decisions have been made, Maran said. The plans "are still in the drawing board stage," he said. Since the investments involved are huge — more than $3 billion — India needs to harness the right technology to set up the facility, he added. Earlier, the secretary of India's Planning Commission said it was in talks with Intel Corp. to study the possibility of building a fab in India. The ministry is also in talks with other chip makers, and the government has offered to invest a small amount to put in such a facility.
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |