Ignios, a recent entrant in the embedded multicore System-on-Chip (SoC) market, announces first product availability
Munich, Germany, 9th November 2004. Ignios Ltd., a recent entrant in the embedded multicore System-on-Chip (SoC) market, announced at Electronica today the immediate availability of version 1.0 of its SystemWeaver™ product.
SystemWeaver addresses the software challenges presented by the proliferation of multicore architectures in the embedded chip market. The SystemWeaver API provides a unified abstraction layer for complex multicore devices. This abstraction allows embedded systems companies to develop and debug multicore applications more effectively, improving time to market. The key underlying system management and communications functions are implemented natively in a SystemWeaver IP core that is integrated on-chip. SystemWeaver unlocks the full performance of the multicore hardware, with significant cost, power and performance benefits that maximise product competitiveness.
Ignios licenses the SystemWeaver IP to companies developing software-programmable multicore chips. Once integrated, SystemWeaver delivers an unparalleled level of abstraction, efficiency and flexibility to embedded systems developers. SystemWeaver is compatible with existing and proposed interconnect, RTOS and processor technologies and requires minimal changes to the host chip architecture.
“We are delighted to announce the launch of Ignios’ first product,” stated Rick Clucas, Ignios CEO. “Having met all of our key staffing, product development and patent milestones, we are now in a position to further engage with prospective customers and partners. At a time when leading semiconductor companies are announcing their plans to introduce multicore to desktop and server processors, chips intended for the embedded market are already an order of magnitude more complex. Feedback from semiconductor, OEM and OS companies confirms that addressing the software programming model and debug challenge is key to the widespread success of multicore embedded chips.”
SystemWeaver release v1.0 consists of the parameterisable, synthesisable SystemWeaver IP core and the SystemWeaver API. A SystemC model of the core and reference models of SystemWeaver-enabled SoCs are also provided.
“There is no doubt that SystemWeaver will change the way that companies think about multicore design,” explained Dan Chester, Ignios co-founder and VP Business Development. “In addition to SystemC models, we have built a strong customer-facing team with the skills necessary to ensure that SystemWeaver meets the needs of our lead customers. These capabilities enable us to work closely with our customers from an early stage of architectural exploration.”
Ignios is currently exhibiting in Hall A6 (“Embedded in Munich”) at Electronica (stand A6.650).
About Ignios Ltd.
Ignios was established in 2003 to develop and market products that enable the real-time onchip system management of complex multicore SoC devices. Ignios’ patent-applied-for SystemWeaver technology will enable the full performance and price-potential of complex multi-core chips to be realised efficiently through software application development. SystemWeaver comprises software and hardware components that can be integrated with little or no modification to the existing chip architecture or cores. It provides a unified programming model to the multi-core device, which enables programmers to continue to develop applications at a high level of abstraction. Ignios raised a total of $3.8 million in a first round of private financing early in 2004. The funding round was jointly led by Alice Lab and BTG. Further information on Ignios can be found at www.ignios.com.
|
Related News
- Ignios, a recent entrant in the embedded multicore System-on-Chip (SoC) market, Shortlisted for Major Industry Award
- Hyundai Announces ARM7[tm] Thumb RISC Core-Based Highly-Integrated System-on-Chip (SoC) Microprocessor and Embedded Flash Microcontroller Family Product line up as GMS30C7201, HMS30C7202, HMS39C7092 and so on
- Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
- Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market
- AMD Targets High-Growth, Embedded Markets with New AMD Embedded G-Series System-on-Chip
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |