CEVA Licenses Xpert-Teak DSP Platform To Sharp For Portable Multimedia Devices
DSP Platform Selected for Video and Audio Application Processing on Portable Multimedia Devices
SAN JOSE, Calif. - November 16, 2004 - CEVA, Inc. (NASDAQ: CEVA, LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communication solutions to the semiconductor industry, today announced that it has licensed the Xpert-Teak DSP platform to the Integrated Circuits Group of Sharp Corporation, targeting video and rich-media image application processing on Sharp's portable multimedia devices and mobile phones.
Sharp's adoption of CEVA Xpert-Teak exploits the platform's high performance at very low power in multimedia application processing for various SoC designs. In deploying Xpert-Teak across their multimedia product range, Sharp breaks the cycle of investing in a new DSP architecture for each new application, and exploits the cost and time-to-market advantages of reusable DSP platforms.
"Sharp's adoption of our Xpert-Teak DSP platform across the multimedia product line in the semiconductor division is a tremendous endorsement of CEVA," commented Chet Silvestri, President and CEO of CEVA. "For next generation devices, CEVA's DSP cores enable important partners such as Sharp focus on developing differentiated and leading solutions in a rapid time-to-market."
About CEVA Xpert-Teak
The Xpert-Teak subsystem is a complete, licensable, DSP subsystem for low-power, low-cost, programmable, DSP-based SoC designs targeted at low-power and high performance applications such as wireless baseband and application processing, digital cameras, consumer and professional audio, VoIP applications and other emerging markets. Built around CEVA's widely adapted dual-MAC CEVA-Teak DSP Core, it is fully synthesizable and process-independent, and can be incorporated into a highly integrated SoC. CEVA Xpert-Teak includes all required hardware peripherals and incorporates on-chip data and program memories, high-performance DMA controller, Buffered Time Division Multiplexing Port (BTDMP), high-throughput Host Processor Interface (HPI), and other interfaces. The subsystem can be used with off-the-shelf software provided by CEVA and its technology partners.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
|
Ceva, Inc. Hot IP
Related News
- CEVA Licenses Xpert-Teak DSP Platform To National Semiconductor
- CEVA Xpert-Teak DSP Subsystem Powers National Semiconductor's New CP3SP33 Telematics Chip Targeting Analog-Rich Automotive Multimedia Applications
- CEVA Partners with eyeSight to Offer Hand Gesture Recognition Solution on CEVA Multimedia Platform for Portable Devices
- Alliantek Licenses CEVA-X DSP and Multimedia Subsystem for Multi-Standard Multimedia Platform
- LSI Logic ZSP DSP Multimedia Platform offers unparalleled format support and reduced time-to-market for portable entertainment devices
Breaking News
- EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
Most Popular
- Arm's power play will backfire
- Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering
- Sondrel announces CEO transition to lead next phase of growth
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
E-mail This Article | Printer-Friendly Page |