CEVA Demonstrates Significant Asia-Pac Momentum With New Customer Wins At Top Asia Pacific Companies
Sharp and Spreadtrum are Latest to License CEVA's Leading DSP Cores and Solutions
SAN JOSE, Calif. - November 16, 2004 - CEVA, Inc., (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced that top Asia Pacific semiconductor and consumer electronics firms are adopting its leading DSP technologies including new wins with China-based Spreadtrum Communications Inc., and Japan-based Sharp Corporation. Moreover, since the beginning of 2004, Asia Pacific industry leaders including Kawasaki Microelectronics (K-Micro), Renesas Technology Corporation, UMC, OKI Electric Industry Company, EoNex Technologies Inc. and Japan Radio Company (JRC) have announced deals with CEVA.
"CEVA's traction in Asia Pacific has been very successful with revenues doubling in the region in 2004. Advanced semiconductor and consumer electronics companies throughout Asia recognize the value of CEVA's portfolio of DSP and communication technologies," said Chet Silvestri, President and CEO of CEVA. "We provide our Asia Pacific customer base with local support and R&D teams."
In 2004, CEVA announced these licensing agreements:
- Sharp Corporation licensed CEVA Xpert-Teak for portable multimedia devices
- Spreadtrum Communications Inc. licensed the CEVA-Teak DSP core for the world's first GSM/GPRS/TD-SCDMA chipset
- Samsung Electronics Company licensed the CEVA-X1620 DSP Core for 3G multimedia handsets
- Kawasaki Microelectronics partnered with CEVA to add fully compliant 1.5Gbps Serial ATA macro to its 0.13 m ASIC IP portfolio
- Renesas Technology licensed CEVA Bluetooth platform and achieved Bluetooth 1.2 certification
- UMC launched the CEVA Foundry Program for CEVA-Teak and CEVA-TeakLite DSP cores
- OKI Electric licensed and deployed the CEVA-Teak DSP core to power digital audio MP3 consumer chip solutions
- Korea's EoNex licensed CEVA-X DSP architecture to power 3G wireless solutions
- Japan Radio Co. licensed CEVA-Teak DSP cores for baseband radio communications
CEVA's portfolio of DSP cores, solutions and communications intellectual property spans multimedia (audio, video, image), location (GPS), communication (VoIP), connectivity (Bluetooth), and high-speed serial communications (SATA, SGMII), all supported by CEVA Services.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
|
Ceva, Inc. Hot IP
Related News
- CEVA Wins Prestigious OFweek China Automotive Industry Award 2024
- Tenstorrent Gains Momentum in Asia With Rapidus Partnership
- Cybertek Solution Wins Multiple Contracts in Asia
- CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022
- Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |