English
Sonics expands operations into Armenia
New Engineering Center Highlights Revenue Growth Strategy
MOUNTAIN VIEW, Calif., January 6, 2005 - Sonics Inc., the premier supplier of system-on-chip (SoC) SMART™ Interconnects, today announced the opening of an engineering design center in Armenia as part of a company-wide resource realignment strategy aimed at supporting revenue growth.“As Sonics completes it’s transition from a start-up-company previously focused on engineering critical first products, to an emerging growth company now focused on enhancing established market positions and expanding it’s customer base, we are rebalancing the company’s resources to support the expected revenue growth.” said Grant Pierce president and CEO.
The Armenia design center will be used for both product development and sustaining infrastructure projects. “The expansion into Armenia enables Sonics to manage engineering costs moving forward as our business expands.” Says Pierce.
The Company also announced it has re-aligned departmental staffing to better support the transition. Geert Rosseel, Senior Vice President of Development Programs has assumed the additional responsibility of managing Sonics’ Applications Engineering Group.
About Sonics
Sonics, Inc. is a leading provider of SMART Interconnects that deliver high SoC design predictability and increase design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
SMART™, SonicsMX™, SonicsMXC™, SiliconBackplane™, SonicsStudio™ and MemMax™ are trademarks of Sonics, Inc.® All other trademarks and registered trademarks are the property of their respective owners.
|
||||||
Related News
- Sonics Expands Presence in China and Taiwan and Appoints Mac Hale Vice President of Asia Operations
- Sonics Expands Asia Operations to Support Regional Business Growth
- NovaSparks Expands Its Operations in Asia-Pacific
- Indie Semiconductor Expands Quality Operations
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |