Top Executives Join eASIC Management Team
San Jose, California, January 10, 2005 -- eASIC® Corporation, a provider of Configurable Logic and Structured ASIC products, today announced that two top executives have joined the company’s management team. Ronnie Vasishta was appointed to Executive Vice President of Marketing and Salah Werfelli was appointed to Executive Vice President of Strategic Business Worldwide. The addition of these distinguished executives will help the company successfully execute its business strategy and achieve its aggressive growth plans in the Structured ASIC and Configurable logic marketplace. Both Werfelli and Vasishta will report to eASIC President and CEO, Zvi Or-Bach.
“We feel very fortunate to have attracted such luminaries to join eASIC,” said Zvi Or-Bach, eASIC Founder and CEO. “It is a significant vote of confidence in eASIC’s technology and in the company’s objective to become the preferred supplier in the Configurable Logic market. Ronnie’s experience and knowledge of the changing ASIC landscape will dovetail very well into his areas of responsibility at eASIC. Salah’s proven capabilities in strategic planning, sales channels and business development will enable eASIC to rapidly move into its next growth phase. We plan to leverage the experience and expertise of people with such caliber and distinction to expand our business worldwide and propel us to a market leadership position”
Prior to joining eASIC, Ronnie Vasishta was Vice President of Technology Marketing at LSI Logic. In this position he oversaw LSI Logic’s strategic technology direction and direct marketing support for customers, sales, vertical market groups and design centers. He was also charged with the definition and development of LSI Logic's technology products including silicon technologies, advanced packaging, mixed-signal, embedded memory, I/Os and methodologies. Most recently he was responsible for the definition, marketing and ramp of LSI Logic’s RapidChip product line. Prior to LSI Logic, Vasishta held process and test engineering positions at Motorola Incorporated and STC Semiconductor. At eASIC Vasishta is responsible for all marketing activities and strategy related to the company’s Structured ASIC and embedded configurable logic products, which utilize award winning via configurable logic technology.
“The decision to leave a company of LSI Logic’s capabilities after 17 years was not easily made,” said Ronnie Vasishta . “However, the $20B ASIC market and $3B FPGA market have reached a point of inflection and is undergoing a significant change. I believe that eASIC is uniquely positioned to take advantage of this change by offering its customers an unprecedented value proposition. That is, the ability to implement complex custom logic design from RTL to tape-out in a matter of a few days. In some cases this has taken just one day. And all for zero NRE. I was excited to see that the eASIC technology has already won top awards from the user community. I hope that I can add my experience and knowledge of this space to help eASIC achieve its growth plans of becoming a Billion dollar Semiconductor Company”.
Werfelli has over 25 years of experience in system and integrated circuit (IC) designs. Prior to joining eASIC he was an Executive Consultant to major start-up companies where he was instrumental in establishing strategic directions and business partnerships. Previously, he served as Senior Vice President of Sales and Marketing for AmmoCore Technology where he instituted a dynamic business model and built a strong revenue pipeline. He came to AmmoCore from Cadence Design Systems where he held various executive positions including Corporate Vice President of Technology Alliances, responsible for M&A and business development worldwide. Earlier, Werfelli was a Vice President of Technical Design Services worldwide. Before Cadence, Werfelli was Vice President of International Field Operations and Sales, Corporate Support and Services Worldwide at Magma Design Automation, and was credited with contributing to the explosive revenue growth of the company. Werfelli started his professional career at Unisys where he spent 14 years in many technical roles.
“eASIC represents a very exciting opportunity as Structured ASIC is currently viewed by analysts as the most viable design technology in the semiconductor chip market,” said Salah Werfelli. “eASIC has a unique and compelling solution that has already garnered significant interest and customer traction from customers who are searching for an affordable ASIC solution. From large system and semiconductor companies to start-ups across all geographies, eASIC’s configurable logic solution is proving to be their most attractive option. I am particularly looking forward to developing the strategic partnerships with industry leaders that will accelerate eASIC’s market penetration and drive the company to a leadership position.”
About eASIC
eASIC® has developed a breakthrough Configurable Logic technology aimed at dramatically reducing the overall fabrication cost and time of customized high-performance semiconductor chips. Its Structured eASIC architecture enables rapid and low-cost ASIC and SoC (System-on-Chip) designs by innovative use of proven programmable logic fabric in conjunction with single-via customizable segmented routing. As single-via generates ten times higher throughput of Direct-write e-Beam customization, it enables eASIC to offer NRE-free Structured ASIC. The Structured eASIC technology was successfully proven in silicon and validated by world-class semiconductor vendors. Partnering with industry leaders to jointly develop, manufacture and market Structured ASIC products, the company is positioned to become the preferred Structured ASIC solution.
eASIC Corporation is a privately held company, Venture Capital backed by Kleiner Perkins Caufield and Byers. Headquartered in San-Jose, California, eASIC was founded in 1999 by Zvi Or-Bach, the founder of Chip Express.
www.eASIC.com
Copyright © 2005 eASIC Corporation. All rights reserved. All company and/or product names may be trade names, trademarks and/or registered trademarks of the respective owners with which they are associated. Features, pricing, availability, and specifications are subject to change without notice.
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