Rambus Announces Executive Management Changes
LOS ALTOS, Calif., Jan 11, 2005 (BUSINESS WIRE) -- Rambus Inc. (Nasdaq:RMBS), a leading provider of chip interface products and services, today announced that Geoff Tate has assumed the role of Chairman of the Board, replacing Bill Davidow who is stepping down as Chairman while remaining a member of the Board of Directors.
Effective immediately, Harold Hughes, a current member of the Rambus board, will assume the position of Chief Executive Officer replacing Mr. Tate. Mr. Hughes brings extensive technology industry experience to the chief executive position including numerous executive leadership roles at Intel Corporation.
"We are positioning the company for the next phase of growth with these leadership changes," said Geoff Tate, Chairman of the Board at Rambus. "Harold brings tremendous energy and industry experience to the chief executive role and will help us drive Rambus to the next level. After nearly 15 years of leading Rambus, one of the world's premiere technology licensing companies, I remain passionate about the company and will continue to be very involved in the continued success of Rambus."
"Rambus's technology leadership is renowned in the industry and the company is uniquely positioned to solve some of the most demanding challenges faced by our semiconductor and system customers," said Harold Hughes, Chief Executive Officer at Rambus. "I am extremely excited about our future prospects and look forward to leading this tremendously talented and committed team."
Mr. Hughes brings over 30 years of industry experience to Rambus. He was most recently the Chairman and CEO of Pandesic LLC, an Intel and SAP joint venture. He served as a United States Army Officer before starting his private sector career with Intel Corporation in 1974. Mr. Hughes held a variety of positions during his 23 years at Intel Corporation, including Treasurer, the head of the Intel Capital division, Chief Financial Officer and the head of Planning and Logistics. Mr. Hughes holds a B.A. from the University of Wisconsin and an MBA from the University of Michigan.
Rambus will discuss these executive changes at its quarterly earnings call, scheduled for Tuesday, January 18, 2005 at 2:00 p.m. PST. This call can be accessed via Rambus's web site at www.rambus.com. A replay will be available following the call on the IR web site for one week at the following numbers: (800) 642-1687 (domestic), (706) 645-9291 (international) and ID#3196579. The Company's conference call will be available through a webcast and can be accessed at Rambus's Investor Relations web site at http://investor.rambus.com/. The replay will be available on Rambus's IR web site following the event.
About Rambus Inc.
Rambus is one of the world's leading providers of advanced chip interface products and services. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina, Taipei, Taiwan and Tokyo, Japan. Additional information is available at www.rambus.com.
SOURCE: Rambus
|
Related News
- Rambus Announces Executive Management Changes
- Virage Logic Updates First-Quarter Outlook and Announces Executive Management Changes
- Rambus Announces Management Changes
- ParthusCeva Announces Executive Management Changes to Enhance North American Focus and Post-Merger Integration of the Company
- Rambus Appoints Luc Seraphin as President and Chief Executive Officer
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |