Massana Expands Worldwide Presence With New Design Center in Madrid
Massana Expands Worldwide Presence With New Design Center in Madrid
Expanded Resources to Propel Development of Broadband Communications Products
Palo Alto, Calif., February 12, 2001 - Massana Inc., an innovator of smart math in silicon for broadband digital communications, announced today that it has opened a design center in Madrid, Spain to assist in the development and implementation of its gigabit Ethernet transceiver product line. The office currently employs more than thirty engineers. Miguel Riaza, general manager, will head the design center and report directly to Brendan O?Flaherty, chief operating officer.
"As we develop next-generation gigabit Ethernet products, we?re always looking for opportunities to expand our team of highly skilled and experienced digital and mixed-signal design engineers," said O?Flaherty. "Spain is home to many top-notch engineering universities, producing some of the best and brightest telecommunications engineering and silicon designers in the world. By opening a design center in Madrid, we will be able to draw on the vast experience of these seasoned designers for their signal processing, analog and high-speed digital design expertise. In addition, they have the silicon back-end IC design experience that will be crucial to our success as a fabless semiconductor company."
Initially, the Madrid-based engineering team will be instrumental in the development and implementation of Massana?s gigabit Ethernet transceiver product line. They will also be involved in the design and development of the company?s next-generation broadband communications products. Members of the Madrid design team have been involved in more than 75 semiconductor designs for products in a variety of markets including the high-speed ATM switch market, ATM physical layer market, XDSL market and other communications and multimedia areas. Members of the team have worked with numerous top-tier semiconductor companies such as Telefonica, Lucent Technologies, IBM and Infineon.
"Massana is at the forefront of the broadband communications revolution, and we are excited to join the company at this exciting time of transition," said Miguel Riaza, general manager, Massana?s Madrid office. "Our team brings a breadth of knowledge in areas with well over 160 years of design experience, ranging from digital design, digital signal processing, analog system and chip design, and back-end IC design. The members of the team have a proven record in implementing and delivering complex communication semiconductor projects."
About Miguel Riaza
Riaza has more than thirteen years of experience in ASIC marketing, sales, quality control and design. Before joining Massana, Riaza worked as an assistant general manager at SIDSA, the largest design services company in Spain. Riaza began his career as an IC design engineer with Semiconductores, a Madrid-based semiconductor design company. He received his engineering degree from the Universidad Politecnica of Madrid.
About Massana
Massana is an innovator of smart math in silicon for broadband digital communications. Massana combines its proprietary methodologies and custom signal processing architectures to take complex mathematics to silicon. By applying this unique approach, Massana provides customers with a new level of broadband capability to meet the exploding demand for wired and wireless Internet bandwidth. Massana is a global technology company with its U.S. headquarters in Palo Alto, Calif., European headquarters and a design center in Dublin, Ireland and a design center in Madrid, Spain. For more information on Massana, visit http://www.massana.com.
For More Information Contact:
Brendan O'Flaherty
Massana Inc.
650/566-0478
brendan.oflaherty@massana.com
Lisa Neitzel
Tsantes & Associates
408/369-1500 x23
lisa@tsantes.com
Related News
- Analog Bits Expands Engineering Presence by Opening a Design Center in Europe
- ARM Expands R&D Presence in Taiwan with Hsinchu Design Center
- Open-Silicon Expands Presence in India With New SoC and Systems Solution Center
- Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company
- Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
Breaking News
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
- Quadric Announces Lee Vick is New VP Worldwide Sales
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |