TTPCom and ARM colloborate on complete IP Platforms for Multimode, 3G Baseband Designs
January 31, 2005 -- TTP Communications plc.[LSE: TTC] and ARM [(LSE:ARM); (Nasdaq:ARMHY)], today announced a strategic collaboration to design and develop the next generation of 3G Intellectual Property (IP) platforms, incorporating ARM® processors and TTPCom Cellular Baseband Engine (CBEmacro) technology. The new platforms will significantly reduce engineering effort and time-to-market for semiconductor vendors developing 3G system-on-chip (SoC) solutions. TTPCom will distribute the combination of an ARM technology-based subsystem and TTPCom’s multimode 3G baseband to semiconductor manufacturers to enable them to get their products to market quickly, with lower cost and risk. ARM will be responsible for licensing the processor core to its silicon partners whilst TTPCom will license the CBEmacro technology.
The first of these platforms will be the CBEmacro 3G, a multimode cellular baseband engine, which provides a complete communications sub-system for GSM, GPRS, EDGE, WCDMA and HSDPA (High Speed Downlink Packet Access). The CBEmacro 3G is delivered pre-verified and warranted, enabling licensees to bring innovative and price competitive products to market more rapidly. The CBEmacro 3G is based on the ARM1156T2-S™ processor and incorporates AMBA™3 AXI methodology, PrimeCell® peripherals and CoreSight™ debug technology. This delivers significant efficiency and performance advantages whilst also providing a familiar processor architecture for semiconductor vendors and their customers. Licensees of CBEmacro 3G will be able to re-use their existing investment in ARM tools and design flows, and rapidly integrate with their in-house IP to make complete cellular SoC products.
“The winning combination of our 3G technology and ARM leading-edge processors will enable silicon Partners to bring high-performance 3G baseband semiconductor solutions to the mass market,” said Tony Milbourn, MD of TTPCom. “The complexity associated with implementing global cellular wireless standards has now been eased. CBEmacro 3G enables silicon Partners and their OEM/ODM customers to reduce integration costs and bring products to market more quickly. By outsourcing the modem design, our mutual customers will be able to focus on more profitable and sustainable sources of product differentiation. This collaboration will instigate change within our industry”.
“Over the last 10 years, TTPCom has become a leader in wireless technology IP and has established a reputation for innovation,” said Warren East, CEO, ARM, “This collaboration between two of the industry’s leading IP vendors will result in a family of ARM Powered® CBEmacro products that will enable our mutual customers to remain competitive, both now and into the future”.
|
Related News
- Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
- Mentor Graphics Questa and Veloce Verification Platforms Add Cache Coherency and Interconnect Performance for ARM AMBA 5 CHI and AMBA 4 ACE Designs
- Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium
- Mindspeed 3G/4G/LTE Baseband Basestation Solution Uses Latest ARM Cortex A9 MPCore in Advanced 40-Nanometer Process Technology
- Sunplus named as the first TTPCom 3G Baseband Chipset Design Customer
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |